Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.31 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.31 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15302202 | 0.78 | TSHR (0.39) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15302088 | 0.75 | TSHR (0.36) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15302044 | 0.75 | TSHR (0.36) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL11591645 | 0.74 | TSHR (0.38) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15302836 | 0.73 | TSHR (0.34) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15302100 | 0.73 | TSHR (0.34) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15302459 | 0.73 | TSHR (0.34) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL15301483 | 0.73 | TSHR (0.34) | TSHRALDH1A1HPGDADRB2ADRB1 | |
| SCHEMBL9252663 | 0.72 | TSHR (0.39) | TSHRALDH1A1HPGD | |
| SCHEMBL5301722 | 0.72 | TSHR (0.43) | TSHRALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108140783-A | The partition board and electrochemical cell of high heat resistance and anti-flammability | 三星SDI株式会社 | 2018-06-08 | — | — | CN | disclosed |
| CN-103717698-B | Adhesive composition, film-like adhesive and circuit connecting material using same, circuit member connecting structure, and method for producing same | 日立化成株式会社 | 2018-05-18 | — | — | CN | disclosed |
| WO-2007021070-A1 | FILM FOR ANISOTROPIC CONDUCTIVITY AND ELECTRONIC CIRCUITS AND DEVICES USING THE FILM | CHEIL INDUSTRIES INC. (KR) | 2007-02-22 | — | — | WO | disclosed |