SCHEMBL534384

SCHEMBL534384

C[Hf](C)(=[SiH2])(C1C=CC2=C1CCCC2)C1C=CC2=C1CCCC2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL4482863 0.98
SCHEMBL4344846 0.78
SCHEMBL1115923 0.77
SCHEMBL6286709 0.73
SCHEMBL4482860 0.73
SCHEMBL5175676 0.73
SCHEMBL7637317 0.73
SCHEMBL7949913 0.73
SCHEMBL3998059 0.73
SCHEMBL6252661 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6136993-A CONTACTING IN GROUP 4 METAL COMPLEX OR ITS LEWIS BASE ADDUCT WITH METAL COMPLEX, RECOVERING RESULTING PRODUCT THE DOW CHEMICAL COMPANY (US) 2000-10-24 US claimed
WO-2024177141-A1 COMPOSITION FOR COMPATIBILIZER AND RECYCLABLE FILM CONTAINING SAME 日本ポリエチレン株式会社 2024-08-29 WO disclosed
EP-2586822-B1 RESIN COMPOSITION FOR SOLAR CELL SEALING MATERIAL, AND SOLAR CELL SEALING MATERIAL AND SOLAR CELL MODULE USING SAME JAPAN POLYETHYLENE CORP (JP) 2016-08-31 EP disclosed
EP-2416375-B1 RESIN COMPOSITION FOR SOLAR CELL SEALING MATERIAL, SOLAR CELL SEALING MATERIAL, AND SOLAR CELL MODULE USING THE MATERIAL JAPAN POLYETHYLENE CORP (JP) 2014-09-10 EP disclosed
EP-2586822-A1 RESIN COMPOSITION FOR SOLAR CELL SEALING MATERIAL, AND SOLAR CELL SEALING MATERIAL AND SOLAR CELL MODULE USING SAME Japan Polyethylene Corporation (JP) 2013-05-01 EP disclosed
EP-2416375-A1 RESIN COMPOSITION FOR SOLAR CELL SEALING MATERIAL, SOLAR CELL SEALING MATERIAL, AND SOLAR CELL MODULE USING THE MATERIAL Japan Polyethylene Corporation (JP) 2012-02-08 EP disclosed
US-6136993-A CONTACTING IN GROUP 4 METAL COMPLEX OR ITS LEWIS BASE ADDUCT WITH METAL COMPLEX, RECOVERING RESULTING PRODUCT THE DOW CHEMICAL COMPANY (US) 2000-10-24 US disclosed
US-6084115-A METAL DIENE-CONTAINING COMPLEXES BY REACTION WITH THE DIVALENT DERIVATIVE OF A BRIDGED BIDENTATE LIGAND; METALLOCENES; RACEMIC ISOMER USED TO PREPARE ISOTACTIC POLYOLEFINS, E.G., CRYSTALLINE POLYPROPYLENE. THE DOW CHEMICAL COMPANY (US) 2000-07-04 US disclosed