SCHEMBL5347199

SCHEMBL5347199

CC=C(C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6826626 1.00
SCHEMBL675035 0.67
SCHEMBL11757373 0.67
SCHEMBL1665354 0.67
SCHEMBL8462341 0.65
SCHEMBL202185 0.64
SCHEMBL7866967 0.64
SCHEMBL891604 0.64
SCHEMBL15738839 0.64
SCHEMBL15738838 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105793326-B Moisture-curable compositions with metal-arene complexes 莫门蒂夫性能材料股份有限公司 2020-07-21 CN claimed
EP-3102325-A1 MOISTURE CURABLE SILICONE COMPOSITION Momentive Performance Materials Inc. (US) 2016-12-14 EP claimed
EP-3074450-A1 MOISTURE CURABLE COMPOUND WITH METAL-ARENE COMPLEXES Momentive Performance Materials Inc. (US) 2016-10-05 EP claimed
EP-3039068-A1 MOISTURE CURABLE COMPOUND WITH AMINO ACIDS Momentive Performance Materials Inc. (US) 2016-07-06 EP claimed
WO-2016106390-A2 MOISTURE CURABLE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2016-06-30 WO claimed
WO-2015119904-A1 MOISTURE CURABLE SILICONE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2015-08-13 WO claimed
WO-2015081146-A1 MOISTURE CURABLE COMPOUND WITH METAL-ARENE COMPLEXES MOMENTIVE PERFORMANCE MATERIALS INC (US) 2015-06-04 WO claimed
WO-2015031712-A1 MOISTURE CURABLE COMPOUND WITH AMINO ACIDS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2015-03-05 WO claimed
US-20040033445-A1 Method of forming a photoresist pattern and method for patterning a layer using a photoresist SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-19 US claimed
CN-117916323-A Non-sagging composition 迈图高新材料公司 2024-04-19 CN disclosed
CN-116888194-A Condensation curable composition comprising a siloxane-imide base polymer 迈图高新材料公司 2023-10-13 CN disclosed
CN-113260677-A Electrostatic dissipative room temperature vulcanizable silicones 迈图高新材料公司 2021-08-13 CN disclosed
CN-107109063-B Thermoplastic composition comprising polyamide and polysiloxane 汉高股份有限及两合公司 2021-02-19 CN disclosed
CN-105229091-B Anti-fouling system comprising silicone-hydrogel 莫门蒂夫性能材料股份有限公司 2019-03-08 CN disclosed
WO-2014126599-A1 ANTIFOULING SYSTEM COMPRISING SILICONE HYDROGEL MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2014-08-21 WO disclosed
US-7297466-B2 Method of forming a photoresist pattern and method for patterning a layer using a photoresist SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-6740725-B2 POLYSILOXANE WITH ALKENOXYSILANE AND GUANIDINE ALKYL SILANE GROUPS; NO DECLINE OF INSULATION RESISTANCE OCCURS WHEN VOLTAGE IS APPLIED IN A HOT HUMID ENVIRONMENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-05-25 US disclosed
US-20040033445-A1 Method of forming a photoresist pattern and method for patterning a layer using a photoresist SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-19 US disclosed
US-20030083455-A1 Room temperature curable organopolysiloxane compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
WO-1983000156-A1 ONE PACKAGE, STABLE, MOISTURE CURABLE, POLYALKOXY-TERMINATED ORGANOPOLYSILOXANE COMPOSITIONS AND METHOD FOR MAKING GEN ELECTRIC (US) 1983-01-20 WO disclosed