SCHEMBL534886

SCHEMBL534886

CCCCC(=O)CC(=O)CCC

nearest known ligand 0.52

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CES1 P23141 7/20 0.52
CES2 O00748 6/20 0.52
HAO1 Q9UJM8 1/20 0.52
ALDH1A1 P00352 2/20 0.48
TP53 P04637 1/20 0.48
MAPT P10636 2/20 0.46
KMT2A Q03164 2/20 0.46
CA1 P00915 1/20 0.46
CASP2 P42575 1/20 0.43
MEN1 O00255 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
HDAC3 O15379 2/20 0.42
HDAC1 Q13547 2/20 0.42
HDAC2 Q92769 2/20 0.42
HDAC8 Q9BY41 2/20 0.42
AKR1B1 P15121 1/20 0.42
HDAC6 Q9UBN7 1/20 0.42
FFAR3 O14843 1/20 0.41
HSP90AA1 P07900 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL534933 0.94 CES1 (0.58) CES1CES2HAO1ALDH1A1TP53
SCHEMBL5273375 0.92 HAO1 (0.61) CES1CES2HAO1ALDH1A1MAPT
SCHEMBL30197621 0.92 CES1 (0.55) CES1CES2HAO1ALDH1A1TP53
Hydrochloric Acid SCHEMBL29053917 0.92 CES1 (0.55) CES1CES2HAO1ALDH1A1TP53
SCHEMBL30197707 0.92 CES1 (0.55) CES1CES2HAO1ALDH1A1TP53
SCHEMBL13860365 0.90 HAO1 (0.65) CES1CES2HAO1ALDH1A1MAPT
SCHEMBL30690339 0.90 HAO1 (0.65) CES1CES2HAO1ALDH1A1MAPT
SCHEMBL11256120 0.90 HAO1 (0.65) CES1CES2HAO1ALDH1A1MAPT
SCHEMBL21552126 0.90 HAO1 (0.65) CES1CES2HAO1ALDH1A1MAPT
SCHEMBL5216311 0.90 HAO1 (0.65) CES1CES2HAO1ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110845987-A High-performance copolyamide hot melt adhesive composition 南通协鑫热熔胶有限公司 2020-02-28 CN claimed
EP-3882234-B1 COBALT COMPLEX, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COBALT-CONTAINING THIN FILM TOSOH CORP (JP) 2024-05-08 EP disclosed
US-11753429-B2 Cobalt complex, method for manufacturing same, and method for manufacturing cobalt-containing thin film TOSOH CORPORATION (JP) 2023-09-12 US disclosed
CN-112839924-B Cobalt complex, method for producing same, and method for producing cobalt-containing thin film 东曹株式会社 2023-07-07 CN disclosed
US-20220017553-A1 COBALT COMPLEX, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COBALT-CONTAINING THIN FILM SAGAMI CHEMICAL RESEARCH INSTITUTE (JP) 2022-01-20 US disclosed
EP-3882234-A1 COBALT COMPLEX, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COBALT-CONTAINING THIN FILM Tosoh Corporation (JP) 2021-09-22 EP disclosed
CN-110845987-B High-performance copolyamide hot melt adhesive composition 南通协鑫热熔胶有限公司 2021-06-25 CN disclosed
CN-112839924-A Cobalt complex, method for producing same, and method for producing cobalt-containing thin film 东曹株式会社 2021-05-25 CN disclosed
CN-110845987-A High-performance copolyamide hot melt adhesive composition 南通协鑫热熔胶有限公司 2020-02-28 CN disclosed
US-10084153-B2 Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element FURUKAWA ELECTRIC CO., LTD. (JP) 2018-09-25 US disclosed
EP-1698646-B1 Photocurable composition and photocurable compound DAINIPPON INK & CHEMICALS (JP) 2007-11-21 EP disclosed
EP-1698646-A1 Photocurable composition and photocurable compound DAINIPPON INK AND CHEMICALS, INC. (JP) 2006-09-06 EP disclosed
US-6207739-B1 Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them KANEGAFUCHI KAGAKU KOGYO KABUSHIKI (JP) 2001-03-27 US disclosed
EP-0114059-B1 METHOD OF PREPARING A POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1989-06-14 EP disclosed
EP-0083690-B1 POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE AND PROCESS FOR PREPARING POLYIMIDE FROM THE SAME KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-03-12 EP disclosed
US-4515915-A Polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-05-07 US disclosed
EP-0114059-A2 Method of preparing a polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-07-25 EP disclosed
US-4454276-A POT LIFE EXTENDING AGENT Kanegafuchi Chkagaku Kogyo Kabushiki Kaisha (JP) 1984-06-12 US disclosed
EP-0083690-A1 Polyamide acid composition for preparing polyimide and process for preparing polyimide from the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1983-07-20 EP disclosed
US-4036605-A CATALYZING OXIDATION OF HYDROCARBONS WITH A B-KETOENOLATE GULF RESEARCH & DEVELOPMENT COMPANY (US) 1977-07-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20220017553-A1 COBALT COMPLEX, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COBALT-CONTAINING THIN FILM CNOT9, OR10J3, MRPL9 CES1 1891/4885CES2 2149/4885HAO1 2747/4885
US-11753429-B2 Cobalt complex, method for manufacturing same, and method for manufacturing cobalt-containing thin film OR10J3, CNOT9, RNF10 CES1 2008/4885CES2 2287/4885HAO1 3064/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.