SCHEMBL5356475

SCHEMBL5356475

CC=CC(=O)OCCCCCCN=C=O

nearest known ligand 0.42

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 4/20 0.42
ATM Q13315 1/20 0.42
TSHR P16473 2/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP3A4 P08684 1/20 0.39
APP P05067 6/20 0.33
MAPT P10636 1/20 0.33
RAB9A P51151 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
HPGD P15428 1/20 0.33
HTT P42858 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
PRSS1 P07477 1/20 0.31
PRSS2 P07478 1/20 0.31
PRSS3 P35030 1/20 0.31
ALOX5 P09917 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5370765 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL5370758 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL27883980 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL27884001 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL27883977 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL5356470 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL25198124 1.00 HCAR2 (0.42) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL3695165 0.98 ATM (0.43) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL3695169 0.98 ATM (0.43) HCAR2ATMTSHRALDH1A1CYP3A4
SCHEMBL5354168 0.93 ATM (0.44) HCAR2ATMTSHRALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7282323-B2 Highly heat-resistant, negative-type photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-10-16 US disclosed
US-20050244739-A1 Highly heat-resistant, negative-type photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2005-11-03 US disclosed
EP-1536286-A1 HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2005-06-01 EP disclosed
US-5847071-A Photosensitive resin composition HITACHI, CHEMICAL CO., LTD. (JP) 1998-12-08 US disclosed
US-5668248-A POLYAMIC ACID ESTERS HITACHI CHEMICAL CO., LTD. (JP) 1997-09-16 US disclosed
US-5472823-A Polyamic acids HITACHI CHEMICAL CO., LTD. (JP) 1995-12-05 US disclosed
EP-0373952-B1 Photosensitive resin composition and photosensitive element using the same HITACHI CHEMICAL CO LTD (JP) 1995-02-08 EP disclosed
US-5262277-A Light sensitive elements for electrical thick films with heat resistance HITACHI CHEMICAL COMPANY, INC. (JP) 1993-11-16 US disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed