Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR1H2 | P55055 | 1/20 | 0.37 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.33 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.33 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.33 |
| ▸ | PPM1B | O75688 | 2/20 | 0.33 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.33 |
| ▸ | PPP1CC | P36873 | 2/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21919411 | 0.85 | PPM1B (0.35) | PPM1BPTPN1PPP1CC | |
| SCHEMBL11760621 | 0.85 | PPM1B (0.35) | PPM1BPTPN1PPP1CC | |
| SCHEMBL21919183 | 0.85 | PPM1B (0.35) | PPM1BPTPN1PPP1CC | |
| SCHEMBL17012024 | 0.85 | PPM1B (0.35) | PPM1BPTPN1PPP1CC | |
| SCHEMBL23862869 | 0.84 | PPM1B (0.34) | PPM1BPTPN1PPP1CC | |
| SCHEMBL16882719 | 0.84 | PPM1B (0.34) | PPM1BPTPN1PPP1CC | |
| SCHEMBL12669739 | 0.84 | PPM1B (0.34) | PPM1BPTPN1PPP1CC | |
| SCHEMBL16588466 | 0.84 | PPM1B (0.34) | PPM1BPTPN1PPP1CC | |
| SCHEMBL23863984 | 0.84 | PPM1B (0.34) | PPM1BPTPN1PPP1CC | |
| SCHEMBL13259839 | 0.81 | PPM1B (0.34) | PPM1BPTPN1PPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6570029-B2 | Encapsulation of electronics | GEORGIA TECH RESEARCH CORP. | 2003-05-27 | — | — | US | claimed |
| US-6498260-B2 | POLYEPOXIDES; ELECTRONIC PACKAGES | GEORGIA TECH RESEARCH CORP. | 2002-12-24 | — | — | US | claimed |
| US-20020035201-A1 | No-flow reworkable epoxy underfills for flip-chip applications | GEORGIA TECH RESEARCH CORPORATION | 2002-03-21 | — | — | US | claimed |
| US-20020013420-A1 | Thermally degradable epoxy underfills for flip-chip applications | GEORGIA TECH RESEARCH CORP. | 2002-01-31 | — | — | US | claimed |
| WO-2001088959-A2 | NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS | GEORGIA TECH RESEARCH CORPORATION (US) | 2001-11-22 | — | — | WO | claimed |
| WO-2001072898-A1 | THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS | GEORGIA TECH RESEARCH CORPORATION (US) | 2001-10-04 | — | — | WO | claimed |
| US-7288161-B2 | Reworkable adhesives containing thermally labile groups | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-10-30 | — | — | US | disclosed |
| US-20060014924-A1 | Reworkable adhesives containing thermally labile groups | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-01-19 | — | — | US | disclosed |
| US-6570029-B2 | Encapsulation of electronics | GEORGIA TECH RESEARCH CORP. | 2003-05-27 | — | — | US | disclosed |
| US-6498260-B2 | POLYEPOXIDES; ELECTRONIC PACKAGES | GEORGIA TECH RESEARCH CORP. | 2002-12-24 | — | — | US | disclosed |
| US-20020035201-A1 | No-flow reworkable epoxy underfills for flip-chip applications | GEORGIA TECH RESEARCH CORPORATION | 2002-03-21 | — | — | US | disclosed |
| US-20020013420-A1 | Thermally degradable epoxy underfills for flip-chip applications | GEORGIA TECH RESEARCH CORP. | 2002-01-31 | — | — | US | disclosed |
| WO-2001088959-A2 | NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS | GEORGIA TECH RESEARCH CORPORATION (US) | 2001-11-22 | — | — | WO | disclosed |