SCHEMBL5363779

SCHEMBL5363779

O=c1[nH]c(=O)n2on12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6293796 0.61
SCHEMBL9483459 0.59
SCHEMBL15823216 0.57 APEX1 (0.31)
SCHEMBL147816 0.57 APEX1 (0.31)
Troclosene SCHEMBL166386 0.57 APEX1 (0.31)
SCHEMBL11365061 0.56 APEX1 (0.30)
SCHEMBL8963332 0.56 CRBN (0.34)
Symclosene SCHEMBL5923704 0.56 APEX1 (0.30)
Troclosene SCHEMBL9081895 0.56 APEX1 (0.30)
SCHEMBL9062088 0.54 IDH1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113710725-A Crosslinkable networks from functionalized polyetherimides and thermoset polymers therefrom 高新特殊工程塑料全球技术有限公司 2021-11-26 CN disclosed
CN-111040130-A Curable high heat epoxy compositions, cured epoxy compositions thereof, methods of manufacture thereof, and articles comprising the same 沙特基础工业全球技术有限公司 2020-04-21 CN disclosed
CN-106536589-A High heat monomer and method of use thereof 沙特基础工业全球技术有限公司 2017-03-22 CN disclosed
CN-103881056-A Epoxy resin composition, method of making same, and articles thereof DOW GLOBAL TECHNOLOGIES LLC 2014-06-25 CN disclosed
CN-101583686-B Composite-forming method, composites formed thereby, and printed circuit boards incorporating them SABIC INNOVATIVE PLASTICS IP 2013-04-17 CN disclosed
CN-101583686-A Composite-forming method, composites formed thereby, and printed circuit boards incorporating them SABIC INNOVATIVE PLASTICS IP (NL) 2009-11-18 CN disclosed
CN-101541859-A Poly (arylene ether) copolymer SABIC INNOVATIVE PLASTICS IP (NL) 2009-09-23 CN disclosed
CN-100384903-C Phosphorus-containing epoxy resin, resin composition, method for producing the same, sealing material, and laminate NIPPON CHEMICAL IND (JP) 2008-04-30 CN disclosed
US-7271225-B2 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2007-09-18 US disclosed
US-20050228148-A1 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2005-10-13 US disclosed
CN-1639223-A Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board NIPPON CHEMICAL IND (JP) 2005-07-13 CN disclosed
US-6403690-B1 HALOGEN-FREE; FREE RADICALLY POLYMERIZABLE MONOMER AND A REACTIVE HYDROXY-FUNCTIONAL CYCLIC PHOSPHINATE; VARNISH FOR GLASS WOVEN FABRICS LAMINATES MATSUSHITA ELECTRIC WORKS, LTD. (JP) 2002-06-11 US disclosed
EP-1059329-A1 Flame retardant resin composition Matsushita Electric Works, Ltd. (JP) 2000-12-13 EP disclosed
CN-1051325-C Phosphorus-modified epoxy resins, process for producing them and their use SIEMENS AG (DE) 2000-04-12 CN disclosed
CN-1119447-A Phosphorus-modified epoxy resins, process for producing them and their use SIEMENS AG (DE) 1996-03-27 CN disclosed
CN-1119446-A Phosphorus-modified epoxy resins, process for producing them and their use SIEMENS AG (DE) 1996-03-27 CN disclosed
US-4631306-A POLYURETHANES FROM POLYEPOXIDES AND POLYISOCYANATES SIEMENS AKTIENGESELLSCHAFT (DE) 1986-12-23 US disclosed
US-4564651-A POLYMERS WITH OXAZOLIDINONE AND ISOCYANURATE RINGS FROM EPOXIDES AND ISOCYANATES SIEMENS AKTIENGESELLSCHAFT (DE) 1986-01-14 US disclosed