SCHEMBL5365524

SCHEMBL5365524

COC(C)OC1(C)CC2C=CC1C2

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5356027 0.82 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5366264 0.80 CYP2D6 (0.34) CYP2D6CYP2C19
SCHEMBL5359884 0.77 CYP2D6 (0.37) CYP2D6CYP2C19
SCHEMBL5356115 0.77 CYP2D6 (0.33) CYP2D6CYP2C19
SCHEMBL5355994 0.72 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5347779 0.71 CYP2D6 (0.34) CYP2D6CYP2C19
SCHEMBL7863152 0.67 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL223593 0.64
SCHEMBL19928619 0.63 CYP2D6 (0.33) CYP2D6CYP2C19
SCHEMBL25362117 0.63 CYP2D6 (0.42) CYP2D6CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
EP-1085379-B1 Radiation-sensitive resin composition JSR CORP (JP) 2006-01-04 EP disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-6623907-B2 Chemical amplified photoresist JSR CORPORATION (JP) 2003-09-23 US disclosed
US-6482568-B1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-11-19 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed