⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4159019 | 0.79 | — | — | |
| SCHEMBL11405157 | 0.74 | — | — | |
| SCHEMBL7847805 | 0.74 | — | — | |
| SCHEMBL9640051 | 0.74 | — | — | |
| SCHEMBL9827872 | 0.74 | — | — | |
| SCHEMBL11356101 | 0.73 | — | — | |
| SCHEMBL5556412 | 0.71 | — | — | |
| SCHEMBL4940644 | 0.69 | — | — | |
| SCHEMBL1526040 | 0.67 | — | — | |
| SCHEMBL11571800 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10662315-B2 | Epoxy resin molding material for sealing and electronic component device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-05-26 | — | — | US | disclosed |
| US-20170121505-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2017-05-04 | — | — | US | disclosed |
| US-20140128505-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-08 | — | — | US | disclosed |
| US-8232355-B2 | Liquid resin composition for electronic components and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2012-07-31 | — | — | US | disclosed |
| US-8129467-B2 | Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-7981977-B2 | Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler | HITACHI CHEMICAL CO., LTD. (JP) | 2011-07-19 | — | — | US | disclosed |
| US-20090286930-A1 | Liquid Resin Composition for Electronic Components and Electronic Component Device | RESONAC CORPORATION (JP) | 2009-11-19 | — | — | US | disclosed |
| US-20090273070-A1 | Liquid Resin Composition for Electronic Components and Electronic Component Device | RESONAC CORPORATION (JP) | 2009-11-05 | — | — | US | disclosed |
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | disclosed |
| US-20090124553-A1 | Suppression of inflammation associated with transplantation using an epsilon PKC inhibitor | NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT | 2009-05-14 | — | — | US | disclosed |
| US-20090062460-A1 | CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| WO-2008137118-A1 | SUPPRESSION OF INFLAMMATION ASSOCIATED WITH TRANSPLANTATION USING AN EPSILON PKC INHIBITOR | THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY (US) | 2008-11-13 | — | — | WO | disclosed |
| US-20060074150-A1 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2006-04-06 | — | — | US | disclosed |
| US-20030201548-A1 | Epoxy resin molding material for sealing | IKEZAWA RYOICHI (JP) | 2003-10-30 | — | — | US | disclosed |