SCHEMBL5374366

SCHEMBL5374366

CCOC(=O)CCc1cn(Cc2ccnc(OCc3nc(-c4ccccc4)oc3C)c2)nc1OCC

nearest known ligand 0.44

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 1/20 0.44
KDR P35968 1/20 0.42
PPARG P37231 16/20 0.39
PPARA Q07869 14/20 0.39
TP53 P04637 1/20 0.37
MAPT P10636 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5377073 0.94 FFAR1 (0.51) FFAR1KDRPPARGPPARA
SCHEMBL5385612 0.90 PPARG (0.36) FFAR1PPARGPPARAMAPT
SCHEMBL5372574 0.89 PPARG (0.48) FFAR1PPARGPPARA
SCHEMBL5383071 0.89 KDR (0.56) FFAR1KDRPPARGPPARA
SCHEMBL5376634 0.89 FFAR1 (0.47) FFAR1KDRPPARGPPARATP53
SCHEMBL5371978 0.88 FFAR1 (0.57) FFAR1KDRPPARGPPARATP53
SCHEMBL5387682 0.87 FFAR1 (0.46) FFAR1KDRPPARGPPARAMAPT
SCHEMBL5397092 0.87 FFAR1 (0.43) FFAR1KDRPPARGPPARA
SCHEMBL5371987 0.87 FFAR1 (0.45) FFAR1KDRPPARGPPARATP53
SCHEMBL5385871 0.86 FFAR1 (0.43) FFAR1KDRPPARGPPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2794750-B1 MALEIMIDE RESINS CYTEC IND INC (US) 2020-12-09 EP disclosed
EP-3508523-A1 MALEIMIDE RESINS Cytec Industries Inc. (US) 2019-07-10 EP disclosed
US-9884942-B2 Maleimide resins CYTEC INDUSTRIES INC. (US) 2018-02-06 US disclosed
EP-2794750-A1 MALEIMIDE RESINS Cytec Industries Inc. (US) 2014-10-29 EP disclosed
US-20140309352-A1 MALEIMIDE RESINS CYTEC INDUSTRIES INC. (US) 2014-10-16 US disclosed
WO-2013096523-A1 MALEIMIDE RESINS CYTEC INDUSTRIES INC. (US) 2013-06-27 WO disclosed
US-7179823-B1 5-membered n-heterocyclic compounds with hypoglycemic and hypolipidemic activity TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2007-02-20 US disclosed
EP-1457490-A1 5-membered N-heterocyclic compounds with hypoglycemic and hypolipidemic activity Takeda Chemical Industries, Ltd. (JP) 2004-09-15 EP disclosed
EP-1228067-B1 5-MEMBERED N-HETEROCYCLIC COMPOUNDS WITH HYPOGLYCEMIC AND HYPOLIPIDEMIC ACTIVITY TAKEDA CHEMICAL INDUSTRIES LTD (JP) 2004-07-14 EP disclosed
EP-1228067-A1 5-MEMBERED N-HETEROCYCLIC COMPOUNDS WITH HYPOGYLCEMIC AND HYPOLIPIDEMIC ACTIVITY Takeda Chemical Industries, Ltd. (JP) 2002-08-07 EP disclosed
EP-0861281-B1 Thermosetting bismaleimide polymer for composite and adhesive applications CYTEC TECH CORP (US) 2002-06-05 EP disclosed
EP-0861280-B1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS CYTEC TECH CORP (US) 2001-12-12 EP disclosed
US-6313248-B1 CURABLE SOLID AROMATIC DIAMINE BISMALEIMIDE AND LIQUID ALKENYLPHENYL RESINS; DECREASED WEIGHT LOSS UPON AGING CYTEC TECHNOLOGY CORP. 2001-11-06 US disclosed
WO-2001038325-A1 5-MEMBERED N-HETEROCYCLIC COMPOUNDS WITH HYPOGLYCEMIC AND HYPOLIPIDEMIC ACTIVITY TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 2001-05-31 WO disclosed
US-5955566-A BISMALEIMIDE MONOMER, COREACTANT WITH OLEFIN AND FREE RADICAL INHIBITOR FOR STORAGE STABILITY CYTEC TECHNOLOGY CORPORATION (US) 1999-09-21 US disclosed
EP-0861280-A1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS Cytec Technology Corp. (US) 1998-09-02 EP disclosed
EP-0861281-A1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS Cytec Technology Corp. (US) 1998-09-02 EP disclosed
WO-1997018254-A1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS CYTEC TECHNOLOGY CORP. (US) 1997-05-22 WO disclosed
WO-1997018255-A1 THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS CYTEC TECHNOLOGY CORP. (US) 1997-05-22 WO disclosed