SCHEMBL538316

SCHEMBL538316

CCC(O)CBr

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14681010 1.00
Acetic Acid SCHEMBL29072253 0.86 FFAR3 (0.37)
3-Pentanol SCHEMBL5341 0.76
SCHEMBL39040 0.76
SCHEMBL18215220 0.73
SCHEMBL9715616 0.73
3-Pentanol SCHEMBL7547369 0.72
3-Pentanol SCHEMBL28041382 0.72
3-Pentanol SCHEMBL3183384 0.72
3-Pentanol SCHEMBL27893485 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 684 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025053791-A1 ONE-POT GRAFTING OF POLYMERS FROM ALCOHOLS AND BIOMASSES NANYANG TECHNOLOGICAL UNIVERSITY (SG) 2025-03-13 WO claimed
US-12172243-B2 Flux, resin flux cored solder using the flux, and soldering method SENJU METAL INDUSTRY CO., LTD. (JP) 2024-12-24 US claimed
CN-118478135-A Solder paste with stable performance and preparation method thereof 深圳市华远金属有限公司 2024-08-13 CN claimed
US-12017307-B2 Flux for resin-cored solder, resin-cored solder, and soldering method SENJU METAL INDUSTRY CO., LTD. (JP) 2024-06-25 US claimed
CN-116600930-B Flux for clad solder, and soldering method 千住金属工业株式会社 2024-04-12 CN claimed
CN-117733407-A Soldering flux special for high-speed tin coating of laminated tile welding strip 无锡市斯威克科技有限公司 2024-03-22 CN claimed
US-20240033863-A1 Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method SENJU METAL INDUSTRY CO., LTD. (JP) 2024-02-01 US claimed
EP-4260971-A1 FLUX FOR RESIN-CORED SOLDER, RESIN-CORED SOLDER, AND SOLDERING METHOD Senju Metal Industry Co., Ltd. (JP) 2023-10-18 EP claimed
CN-116600930-A Flux for clad solder, and soldering method 千住金属工业株式会社 2023-08-15 CN claimed
CN-111362867-B Mobile terminal, shell assembly, electrochromic material and preparation method thereof 宁波祢若电子科技有限公司 2023-04-18 CN claimed
US-4814313-A COORDINATION CATALYSTS TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) 1989-03-21 US claimed
US-4814312-A COORDINATION CATALYSTS TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) 1989-03-21 US claimed
US-4814311-A COORDINATION CATALYSTS TOA NENRYO KOGYO KABUSHIKI KAISHA (JP) 1989-03-21 US claimed
EP-0122151-B1 PRODUCTION OF PRIMARY OR SECONDARY ALCOHOL DERIVATIVES OF PHOSPHOLIPIDS BY THE ENZYMATIC TECHNIQUE MEITO SANGYO KABUSHIKI KAISHA (JP) 1989-02-15 EP claimed
US-4783402-A Production of primary or secondary alcohol derivatives of phospholipids by the enzymatic technique MEITO SANGYO KABUSHIKI KAISHA (JP) 1988-11-08 US claimed
EP-0273693-A1 Method for production of catalyst component for olefin polymerization Tonen Corporation (JP) 1988-07-06 EP claimed
EP-0273694-A1 Method for production of catalyst component for olefin polymerization Tonen Corporation (JP) 1988-07-06 EP claimed
EP-0273695-A1 Method of production of catalyst carrier for polymerization of olefin Tonen Corporation (JP) 1988-07-06 EP claimed
EP-0122151-A2 Production of primary or secondary alcohol derivatives of phospholipids by the enzymatic technique MEITO SANGYO KABUSHIKI KAISHA (JP) 1984-10-17 EP claimed
US-4255340-A Method for preparing an alkenyl-substituted dicarboxylic acid anhydride TEXACO INC. (US) 1981-03-10 US claimed