SCHEMBL5402986

SCHEMBL5402986

CCC(N)CC(C)(CC(N)CC)CC(N)CC

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12343738 0.81
SCHEMBL2627114 0.81
SCHEMBL15250378 0.81
SCHEMBL3341418 0.79
SCHEMBL5404483 0.78
SCHEMBL23374519 0.77 TSHR (0.30) TSHR
SCHEMBL15604717 0.77
SCHEMBL13446015 0.77
SCHEMBL28652626 0.77
SCHEMBL24784106 0.77 TSHR (0.30) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240294956-A1 ASPARTIC ACID COMPOSITION, POLYSUCCINIMIDE COMPOSITION, POLYASPARTIC ACID COMPOSITION, AND CROSS-LINKED POLYASPARTIC ACID COMPOSITION DIC CORPORATION (JP) 2024-09-05 US disclosed
EP-4365219-A1 ASPARTIC ACID COMPOSITION, POLYSUCCINIMIDE COMPOSITION, POLYASPARTIC ACID COMPOSITION, AND CROSS-LINKED POLYASPARTIC ACID COMPOSITION DIC Corporation (JP) 2024-05-08 EP disclosed
WO-2023276396-A1 ASPARTIC ACID COMPOSITION, POLYSUCCINIMIDE COMPOSITION, POLYASPARTIC ACID COMPOSITION, AND CROSS-LINKED POLYASPARTIC ACID COMPOSITION DIC株式会社 2023-01-05 WO disclosed
EP-3372624-A1 ONE COMPONENT COMPOSITION BASED ON COMPOUNDS WITH AT LEAST TWO EXO-VINYLENE CYCLIC CARBONATE UNITS Henkel AG & Co. KGaA (DE) 2018-09-12 EP disclosed
US-7189770-B2 Curing component and curable resin composition containing the curing component THE YOKOHAMA RUBBER CO., LTD. (JP) 2007-03-13 US disclosed
US-20040116644-A1 Curing component and curable resin composition containing the curing component YOKOHAMA RUBBER CO., LTD., THE (JP) 2004-06-17 US disclosed