SCHEMBL5484351

SCHEMBL5484351

C=C(F)C(F)(F)OC(F)(C(F)(F)F)C(F)(F)OC(F)(C(F)(F)F)C(F)(F)OC(F)(C(F)(F)F)C(F)(F)OC(F)(C(=O)O)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5483227 1.00
Ammonia Solution, Strong SCHEMBL8468147 0.98
SCHEMBL709361 0.98
Ammonia Solution, Strong SCHEMBL3483075 0.97
SCHEMBL4258788 0.84 TET2 (0.31)
SCHEMBL6151374 0.83
SCHEMBL4626115 0.83
SCHEMBL8466064 0.83
Ammonia Solution, Strong SCHEMBL4161928 0.82 TET2 (0.31)
Ammonia Solution, Strong SCHEMBL30373200 0.82 TET2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1686425-B1 METHOD FOR FORMING MULTILAYER RESIST DAIKIN IND LTD (JP) 2018-06-13 EP disclosed
US-9040223-B2 Resist composition, patterning process and polymer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-26 US disclosed
US-20140178820-A1 RESIST COMPOSITION, PATTERNING PROCESS AND POLYMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-06-26 US disclosed
US-20070196763-A1 Method of forming laminated resist DAIKIN INDUSTRIES, LTD. 2007-08-23 US disclosed
EP-1686425-A1 METHOD FOR FORMING MULTILAYER RESIST Daikin Industries, Ltd. (JP) 2006-08-02 EP disclosed