SCHEMBL550886

SCHEMBL550886

O=C=NCCCC1CC2CC(CCN=C=O)C1C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7194694 0.96
SCHEMBL7192960 0.95
SCHEMBL7202239 0.93
SCHEMBL7189300 0.93
SCHEMBL4182665 0.93
SCHEMBL7183279 0.91
SCHEMBL7189730 0.91
SCHEMBL25278871 0.90
SCHEMBL7188732 0.89
SCHEMBL7192996 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112673039-B Sprayable polythioether coatings and sealants PRC-迪索托国际公司 2022-12-06 CN disclosed
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
US-20050182225-A1 Curable resin composition KONISHI CO. LTD (JP) 2005-08-18 US disclosed
EP-1514903-A1 CURABLE RESIN COMPOSITION Konishi Co., Ltd. (JP) 2005-03-16 EP disclosed
US-20030036620-A1 From an aromatic isocyanate having a structure in which the isocyanate groups are not directly bonded to a benzene ring, an aliphatic isocyanate, an alicyclic isocyanate, and derivatives of these isocyanates. MITSUI CHEMICALS, INC. (JP) 2003-02-20 US disclosed
EP-1167416-A1 URETHANE RESIN COMPOSITION FOR SEALING OPTOELECTRIC CONVERSION DEVICES Mitsui Chemicals, Inc. (JP) 2002-01-02 EP disclosed