SCHEMBL551890

SCHEMBL551890

CC(C#N)=CCC#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9814899 1.00
SCHEMBL6699206 0.77 TDP1 (0.35)
SCHEMBL4946068 0.77
SCHEMBL576342 0.74
SCHEMBL4923482 0.74
SCHEMBL576341 0.74
SCHEMBL8077291 0.72
SCHEMBL10907223 0.72
SCHEMBL28356297 0.72
SCHEMBL11346090 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104499361-B AKD sizing agent containing nano microcrystalline cellulose, and preparation method and application thereof 国家纳米科学中心 2017-02-22 CN claimed
CN-116404262-A Electrochemical device and electronic device 宁德新能源科技有限公司 2023-07-07 CN disclosed
CN-114072949-B Electrochemical device and electronic device 宁德新能源科技有限公司 2023-07-07 CN disclosed
CN-116404263-A Electrochemical device and electronic device 宁德新能源科技有限公司 2023-07-07 CN disclosed
CN-103483853-B Hardening resin composition 小西株式会社 2017-03-01 CN disclosed
CN-105037203-A Preparation method of 1,3,6-hexanetricarbonitrile SHIJIAZHUANG SHENGTAI CHEMICAL CO LTD 2015-11-11 CN disclosed
CN-103483853-A Solidified resin composition KONISHI CO LTD 2014-01-01 CN disclosed
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
CN-100590149-C Curable resin composition and moisture-curing adhesive composition KONISHI CO LTD 2010-02-17 CN disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
CN-1823139-A Curable resin composition and moisture-curing adhesive composition KONISHI CO LTD (JP) 2006-08-23 CN disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
US-6562993-B1 This invention relates to preservative compounds, and more particularly, to monobromodinitrile and dibromodinitrile compounds having bromine atoms positioned alpha to the nitrile groups, which exhibit excellent preservative activity ISP INVESTMENTS INC. 2003-05-13 US disclosed
US-5010103-A Anticarcinogenic agents THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF N.Y. (US) 1991-04-23 US disclosed
US-4927966-A ANTITUMOR THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK (US) 1990-05-22 US disclosed
EP-0110089-B1 POLYMER-BOUND ALKYL DIARYLPHOSPHINITE CATALYST COMPOSITIONS AND PROCESSES FOR MAKING SAME AND USING SAME FOR SELECTIVE CONVERSION OF ACRYLONITRILE INTO 1,4-DICYANO-1-BUTENE ALLIED CORPORATION (US) 1988-01-07 EP disclosed
EP-0110089-A2 Polymer-bound alkyl diarylphosphinite catalyst compositions and processes for making same and using same for selective conversion of acrylonitrile into 1,4-dicyano-1-butene ALLIED CORPORATION (US) 1984-06-13 EP disclosed
US-4100186-A CONVERSION OF ACRYLONITRILE TO DIMER PRODUCT BY REACTION WITH ORGANIC PHOSPHITE CATALYSTS IMPERIAL CHEMICAL INDUSTRIES LIMITED (GB) 1978-07-11 US disclosed