SCHEMBL554590

SCHEMBL554590

CCO[Si](N[Si](OCC)(OCC)OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL817964 0.97
SCHEMBL2964602 0.91
Cyclopropane SCHEMBL3206743 0.91
SCHEMBL1143089 0.76
SCHEMBL372625 0.73
SCHEMBL8832908 0.71
SCHEMBL495516 0.71 MEN1 (0.32)
SCHEMBL372481 0.69
SCHEMBL495411 0.69
SCHEMBL1275977 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114907813-A Single-component condensed type silicone sealant resistant to long-time water boiling and preparation method thereof 广州以恒有机硅有限公司 2022-08-16 CN claimed
CN-113416092-B Double-component nano sol type liquid hardening agent and preparation method thereof 浙江大学杭州国际科创中心 2022-04-12 CN claimed
CN-113416092-A Double-component nano sol type liquid hardening agent and preparation method thereof 浙江大学杭州国际科创中心 2021-09-21 CN claimed
CN-117178078-A Aqueous chromium-free surface treatment agent, surface treatment metal and surface treatment method 日涂表面处理化工有限公司 2023-12-05 CN disclosed
US-11773273-B2 Aqueous primer JOTUN A/S (NO) 2023-10-03 US disclosed
CN-116783264-A Method for incorporating gelation and phase separation inhibitors into filled polyurethane reactive hot melt adhesives 汉高股份有限及两合公司 2023-09-19 CN disclosed
EP-3080209-B2 COATED METAL PIGMENTS, METHOD FOR THE PRODUCTION AND THE USE THEREOF, COATING AGENT AND ARTICLE ECKART GMBH (DE) 2023-06-14 EP disclosed
EP-3408335-B1 SHOP PRIMER JOTUN AS (NO) 2023-01-18 EP disclosed
WO-2022209453-A1 AQUEOUS CHROME-FREE SURFACE TREATMENT AGENT, SURFACE TREATMENT METAL, AND SURFACE TREATMENT METHOD 日本ペイント・サーフケミカルズ株式会社 2022-10-06 WO disclosed
CN-114907813-A Single-component condensed type silicone sealant resistant to long-time water boiling and preparation method thereof 广州以恒有机硅有限公司 2022-08-16 CN disclosed
CN-110698961-B Chromium-free metal surface treatment agent, metal surface treatment method and metal base material 日涂表面处理化工有限公司 2022-08-02 CN disclosed
US-20120031302-A1 AQUEOUS SILANE SYSTEMS BASED ON TRIS(ALKOXYSILYLALKYL)AMINES AND THE USE THEREOF EVONIK DEGUSSA GMBH (DE) 2012-02-09 US disclosed
US-20110268899-A1 AQUEOUS SILANE SYSTEMS BASED ON BIS(TRIALKOXYSILYLALKYL)AMINES EVONIK DEGUSSA GMBH (DE) 2011-11-03 US disclosed
WO-2011103939-A1 COMPOSITIONS OF METAL OXIDES FUNCTIONALISED BY OLIGOMER SILOXANOLS AND USE THEREOF EVONIK DEGUSSA GMBH (DE) 2011-09-01 WO disclosed
US-7943531-B2 Methods for forming a silicon oxide layer over a substrate APPLIED MATERIALS, INC. (US) 2011-05-17 US disclosed
WO-2010121872-A1 AQUEOUS SILANE SYSTEMS BASED ON TRIS(ALKOXYSILYLALKYL)AMINES AND THE USE THEREOF EVONIK DEGUSSA GMBH (DE) 2010-10-28 WO disclosed
US-20090208880-A1 PROCESS SEQUENCE FOR FORMATION OF PATTERNED HARD MASK FILM (RFP) WITHOUT NEED FOR PHOTORESIST OR DRY ETCH APPLIED MATERIALS, INC. (US) 2009-08-20 US disclosed
US-20090104791-A1 Methods for Forming a Silicon Oxide Layer Over a Substrate APPLIED MATERIALS, INC. A DELAWARE CORPORATION (US) 2009-04-23 US disclosed
US-7498273-B2 Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes APPLIED MATERIALS, INC. (US) 2009-03-03 US disclosed
US-20070281495-A1 FORMATION OF HIGH QUALITY DIELECTRIC FILMS OF SILICON DIOXIDE FOR STI: USAGE OF DIFFERENT SILOXANE-BASED PRECURSORS FOR HARP II - REMOTE PLASMA ENHANCED DEPOSITION PROCESSES APPLIED MATERIALS, INC. (US) 2007-12-06 US disclosed