⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL535377 | 0.84 | — | — | |
| SCHEMBL28992797 | 0.84 | ZDHHC7 (0.33) | — | |
| SCHEMBL28992803 | 0.82 | ZDHHC7 (0.36) | — | |
| SCHEMBL14672422 | 0.82 | — | — | |
| SCHEMBL28992814 | 0.80 | ZDHHC7 (0.31) | — | |
| SCHEMBL3631748 | 0.80 | — | — | |
| Alcohol SCHEMBL28245249 | 0.80 | — | — | |
| SCHEMBL558056 | 0.79 | — | — | |
| SCHEMBL28992782 | 0.78 | ZDHHC7 (0.33) | — | |
| Ammonia Solution, Strong SCHEMBL9358798 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12637599-B2 | Two-component polyurethane adhesive composition for film lamination in hot filling application | HENKEL AG & CO. KGAA (DE) | 2026-05-26 | — | — | US | claimed |
| US-12577447-B2 | Two-component polyurethane adhesive composition for film lamination | HENKEL AG & CO. KGAA (DE) | 2026-03-17 | — | — | US | claimed |
| EP-4370570-B1 | TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION IN HOT FILLING APPLICATION | HENKEL AG & CO KGAA (DE) | 2025-05-14 | — | — | EP | claimed |
| EP-4370571-B1 | POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION | HENKEL AG & CO KGAA (DE) | 2025-05-14 | — | — | EP | claimed |
| EP-4370569-B1 | TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION CONTAINING METHOXYSILANE FUNCTIONALIZED ISOCYANATE COMPOUND FOR FILM LAMINATION | HENKEL AG & CO KGAA (DE) | 2025-05-14 | — | — | EP | claimed |
| EP-4370568-B1 | TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION | HENKEL AG & CO KGAA (DE) | 2025-05-14 | — | — | EP | claimed |
| US-20250002767-A1 | Two-Component Polyurethane Adhesive Composition for Film Lamination in Hot Filling Application | HENKEL AG & CO. KGAA (DE) | 2025-01-02 | — | — | US | claimed |
| US-20240336818-A1 | Two-Component Polyurethane Adhesive Composition for Film Lamination | HENKEL AG & CO KGAA (DE) | 2024-10-10 | — | — | US | claimed |
| US-20240316900-A1 | Two-Component Polyurethane Adhesive Composition Containing Methoxysilane Functionalized Isocyanate Compound for Film Lamination | HENKEL AG & CO. KGAA (DE) | 2024-09-26 | — | — | US | claimed |
| US-20240301259-A1 | Polyurethane Adhesive Composition for Film Lamination | HENKEL AG & CO. KGAA (DE) | 2024-09-12 | — | — | US | claimed |
| US-8314264-B2 | Photopolymerizable functional radical-containing organosilicon compound and making method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-11-20 | — | — | US | claimed |
| US-20120037040-A1 | COMPOSITION CONTAINING QUATERNARY AMINO-FUNCTIONAL ORGANOSILICON COMPOUNDS AND PRODUCTION AND USE THEREOF | EVONIK DEGUSSA GMBH (DE) | 2012-02-16 | — | — | US | claimed |
| WO-2011128128-A1 | ALKYL- AND AMINO-FUNCTIONALIZED SILOXANES COMPRISING BIS(ALKOXYSILYL)AMINE FOR THE MASS HYDROPHOBIZATION OF INORGANIC BUILDING MATERIALS | EVONIK DEGUSSA GMBH (DE) | 2011-10-20 | — | — | WO | claimed |
| EP-1278796-B1 | POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM | ST MICROELECTRONICS SRL (IT) | 2004-11-10 | — | — | EP | claimed |
| US-6645643-B2 | For plastic packaging material for microelectronic applications | STMICROELECTRONICS S.R.L. (IT) | 2003-11-11 | — | — | US | claimed |
| EP-1278796-A1 | POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM | STMicroelectronics S.r.l. (IT) | 2003-01-29 | — | — | EP | claimed |
| US-20020022679-A1 | For plastic packaging material for microelectronic applications | STMICROELECTRONICS S.R.L. (IT) | 2002-02-21 | — | — | US | claimed |
| WO-2001083604-A1 | POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM | STMICROELECTRONICS S.R.L. (IT) | 2001-11-08 | — | — | WO | claimed |
| EP-1149864-A1 | Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom | STMicroelectronics S.r.l. (IT) | 2001-10-31 | — | — | EP | claimed |
| US-5444110-A | A triazine compound and a plasticizer | NIPPON ZEON CO., LTD. (JP) | 1995-08-22 | — | — | US | claimed |