SCHEMBL5554233

SCHEMBL5554233

O=[V].[SrH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1321587 0.89
SCHEMBL28444303 0.89
SCHEMBL2481 0.87
SCHEMBL8858870 0.87
SCHEMBL23629103 0.75
SCHEMBL12478870 0.75
SCHEMBL15524775 0.75
Hydrochloric Acid SCHEMBL6936982 0.75
SCHEMBL1521222 0.75
Hydrochloric Acid SCHEMBL124561 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7002176-B2 Vertical organic transistor RICOH COMPANY, LTD. (JP) 2006-02-21 US claimed
US-20040004215-A1 Vertical organic transistor RICOH COMPANY, LTD. (JP) 2004-01-08 US claimed
US-20250294784-A1 CAPACITOR, MEMORY DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-09-18 US disclosed
US-12356643-B2 Capacitor, memory device including the capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-07-08 US disclosed
CN-118919128-A High-stability metal nanowire transparent conductive film and electronic device 四川大学 2024-11-08 CN disclosed
US-11749713-B2 Capacitor including perovskite material, semiconductor device including the capacitor, and method of manufacturing the capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-09-05 US disclosed
US-11749714-B2 Capacitor including perovskite material, semiconductor device including the capacitor, and method of manufacturing the capacitor SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-09-05 US disclosed
US-20230102906-A1 CAPACITOR, MEMORY DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-03-30 US disclosed
CN-113816422-B Metal vanadate nanocomposite, preparation method thereof and lithium ion secondary battery 四川大学 2022-11-22 CN disclosed
US-20220328616-A1 CAPACITOR INCLUDING PEROVSKITE MATERIAL, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-10-13 US disclosed
US-20220328615-A1 CAPACITOR INCLUDING PEROVSKITE MATERIAL, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2022-10-13 US disclosed
US-7002176-B2 Vertical organic transistor RICOH COMPANY, LTD. (JP) 2006-02-21 US disclosed
US-20040004215-A1 Vertical organic transistor RICOH COMPANY, LTD. (JP) 2004-01-08 US disclosed
EP-0749162-B1 Vertical MISFET devices, CMOS process integration, RAM applications IMEC INTER UNI MICRO ELECTR (BE) 2003-09-03 EP disclosed
WO-2002009126-A2 SPIN VALVE STRUCTURE MOTOROLA, INC. (US) 2002-01-31 WO disclosed
US-6207977-B1 Vertical MISFET devices INTERUNIVERSITAIRE MICROELEKTRONICA (BE) 2001-03-27 US disclosed
US-5963800-A CMOS integration process having vertical channel INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM (IMEC VZW) (BE) 1999-10-05 US disclosed
US-5920088-A Vertical MISFET devices INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (IMEC VZW) (BE) 1999-07-06 US disclosed
US-5914504-A DRAM applications using vertical MISFET devices IMEC VZW (BE) 1999-06-22 US disclosed
EP-0749162-A2 Vertical MISFET devices, CMOS process integration, RAM applications INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW (BE) 1996-12-18 EP disclosed