SCHEMBL557062

SCHEMBL557062

CCO[Si](C)(C)C(CC)NC(CC)[Si](C)(C)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1822500 0.91
SCHEMBL6713226 0.85
SCHEMBL1136258 0.83
SCHEMBL1136030 0.81
SCHEMBL444997 0.80
SCHEMBL57189 0.77
SCHEMBL558056 0.77
SCHEMBL27813320 0.76
SCHEMBL7947914 0.74
SCHEMBL6143152 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4370568-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370569-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION CONTAINING METHOXYSILANE FUNCTIONALIZED ISOCYANATE COMPOUND FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370570-B1 TWO-COMPONENT POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION IN HOT FILLING APPLICATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
EP-4370571-B1 POLYURETHANE ADHESIVE COMPOSITION FOR FILM LAMINATION HENKEL AG & CO KGAA (DE) 2025-05-14 EP claimed
US-20250002767-A1 Two-Component Polyurethane Adhesive Composition for Film Lamination in Hot Filling Application HENKEL AG & CO. KGAA (DE) 2025-01-02 US claimed
US-20240336818-A1 Two-Component Polyurethane Adhesive Composition for Film Lamination HENKEL AG & CO KGAA (DE) 2024-10-10 US claimed
US-20240316900-A1 Two-Component Polyurethane Adhesive Composition Containing Methoxysilane Functionalized Isocyanate Compound for Film Lamination HENKEL AG & CO. KGAA (DE) 2024-09-26 US claimed
US-20240301259-A1 Polyurethane Adhesive Composition for Film Lamination HENKEL AG & CO. KGAA (DE) 2024-09-12 US claimed
US-20120296024-A1 ORGANOSILICON COMPOUND AND ITS PRODUCTION METHOD, COMPOUNDING AGENT FOR RUBBER, RUBBER COMPOSITION, AND TIRE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-22 US claimed
EP-2524923-A1 Organosilicon compound and its production method, compounding agent for rubber, rubber composition, and tire Shin-Etsu Chemical Co., Ltd. (JP) 2012-11-21 EP claimed
US-8314264-B2 Photopolymerizable functional radical-containing organosilicon compound and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-11-20 US claimed
EP-3543246-B1 COMPOSITION CONTAINING ORGANIC SILICON COMPOUND AND PAINT AND ADHESIVE CONTAINING SAID COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-05-15 EP disclosed
US-10995106-B2 Composition containing organic silicon compound and paint and adhesive containing said composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-05-04 US disclosed
US-10941323-B2 Composite of metal and resin ADVANCED TECHNOLOGIES, INC. (JP) 2021-03-09 US disclosed
US-20200377767-A1 COMPOSITE OF METAL AND RESIN ADVANCED TECHNOLOGIES, INC. (JP) 2020-12-03 US disclosed
EP-2289898-A1 Melamine-Functional organosilicon compound and making method Shin-Etsu Chemical Co., Ltd. (JP) 2011-03-02 EP disclosed
US-20110003989-A1 MELAMINE-FUNCTIONAL ORGANOSILICON COMPOUND AND MAKING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2011-01-06 US disclosed
US-20100210862-A1 Photopolymerizable functional radical-containing organosilicon compound and making method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-19 US disclosed
US-20040028978-A1 Proton conducting membrane, method for producing the same, and fuel cell using the same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2004-02-12 US disclosed
EP-1334993-A2 Proton conducting membrane, method for producing the same, and fuel cell using the same National Institute of Advanced Industrial Science and Technology (JP) 2003-08-13 EP disclosed