SCHEMBL5572070

SCHEMBL5572070

C=CC[Si](CC)(OCCC)OCCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22661033 0.98
SCHEMBL22654298 0.94
SCHEMBL3338598 0.91 TSHR (0.33) TSHR
SCHEMBL10923660 0.90
SCHEMBL22654287 0.85 TSHR (0.37) TSHR
SCHEMBL460977 0.84
SCHEMBL5575114 0.84
SCHEMBL460978 0.84
SCHEMBL22654188 0.84
SCHEMBL2166852 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
EP-3971229-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-03-23 EP disclosed
EP-3957678-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER Tokyo Ohka Kogyo Co., Ltd. (JP) 2022-02-23 EP disclosed
US-20200362115-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA-BASED COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-19 US disclosed
CN-101515113-B Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same JSR CORP 2012-07-18 CN disclosed
CN-101646959-B Lens NIPPON STEEL CHEMICAL CO 2012-06-27 CN disclosed
CN-101410437-B Curable resin, curable resin compositions and moldings thereof NIPPON STEEL CHEMICAL CO 2012-01-04 CN disclosed
US-20030151032-A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof JSR CORPORATION (JP) 2003-08-14 US disclosed
US-6548582-B2 Inorganic particles, binder resin and at least one plasticizer selected from dialk(en)yl ester of alkanedioic acids, or alkoxyalkylylated esters therof, or 1,2-propanediol 1-alkanoates; flexibility JSR CORPORATION (JP) 2003-04-15 US disclosed
EP-0877003-B1 Glass paste composition JSR CORP (JP) 2002-09-18 EP disclosed
US-20020035183-A1 Inorgaic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR CORPORATION (JP) 2002-03-21 US disclosed
US-20020016401-A1 Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR CORPORATION (JP) 2002-02-07 US disclosed
US-6339118-B1 FOR FORMING BARRIER, ELECTRODE, RESISTOR, DIELECTRIC LAYER, PHOSPHOR, COLOR FILTER OR BLACK MATRIX OF PLASMA DISPLAY PANEL JSR CORPORATION (JP) 2002-01-15 US disclosed
EP-1003199-A2 Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process JSR Corporation (JP) 2000-05-24 EP disclosed
US-6046121-A MIXTURE COMPRISING GLASS POWDER, HYDROPHILIC ACRYLATE POLYMER BINDER RESIN IN A NONAQUEOUS SOLVENT HAVING BOILING POINT BETWEEN 100 AND 200 DEGREES C., AND A LOW VAPOR PRESSURE JSR CORPORATION (JP) 2000-04-04 US disclosed
EP-0987228-A2 Glass paste composition, and transfer film and plasma display panel comprising the same JSR Corporation (JP) 2000-03-22 EP disclosed
EP-0877003-A2 Glass paste composition JSR Corporation (JP) 1998-11-11 EP disclosed