⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21834090 | 0.78 | MAPK1 (0.33) | — | |
| SCHEMBL22471852 | 0.71 | MAPK1 (0.32) | — | |
| SCHEMBL27957856 | 0.71 | MAPK1 (0.38) | — | |
| SCHEMBL1860152 | 0.67 | MAPK1 (0.35) | — | |
| SCHEMBL8814636 | 0.67 | PPM1B (0.33) | — | |
| SCHEMBL6849350 | 0.66 | MAPK1 (0.33) | — | |
| SCHEMBL16440131 | 0.64 | — | — | |
| SCHEMBL36696 | 0.64 | TFPI2 (0.34) | — | |
| SCHEMBL9570482 | 0.64 | MAPK1 (0.33) | — | |
| SCHEMBL1547983 | 0.63 | MAPK1 (0.45) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2655528-B1 | BICOMPONENT REACTIVE INK FOR INK JET PRINTING | SICPA HOLDING SA (CH) | 2015-02-11 | — | — | EP | claimed |
| EP-2655528-A1 | BICOMPONENT REACTIVE INK FOR INK JET PRINTING | OLIVETTI S.p.A. (IT) | 2013-10-30 | — | — | EP | claimed |
| WO-2012084052-A1 | BICOMPONENT REACTIVE INK FOR INK JET PRINTING | OLIVETTI S.P.A. (IT) | 2012-06-28 | — | — | WO | claimed |
| EP-1864323-A1 | REFRACTORY SOLID, ADHESIVE COMPOSITION, AND DEVICE, AND ASSOCIATED METHOD | General Electric Company (US) | 2007-12-12 | — | — | EP | disclosed |
| WO-2006107660-A1 | REFRACTORY SOLID, ADHESIVE COMPOSITION, AND DEVICE, AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2006-10-12 | — | — | WO | disclosed |
| US-20060147719-A1 | Curable epoxy composition with colloidal silica and phenolic resins on substrates | MOMENTIVE PERFORMANCE MATERIALS INC. | 2006-07-06 | — | — | US | disclosed |
| US-20050266263-A1 | Refractory solid, adhesive composition, and device, and associated method | GENERAL ELECTRIC COMPANY | 2005-12-01 | — | — | US | disclosed |