SCHEMBL55749

SCHEMBL55749

CCCOC(C)COC(C)COC(C)CO

nearest known ligand 0.50

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
HSD17B10 Q99714 1/20 0.38
USP2 O75604 1/20 0.35
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2956700 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL19985781 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL11144380 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL25240395 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL29850 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL25285050 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL3894762 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL12755494 1.00 TDP1 (0.50) TDP1HSD17B10USP2TSHR
SCHEMBL27982434 0.98 TDP1 (0.48) TDP1HSD17B10USP2TSHR
Ethylene Glycol SCHEMBL29023307 0.96 TDP1 (0.47) TDP1HSD17B10USP2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4404 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260028500-A1 SEALING FILM COMPOSITIONS FOR SEALING MICROCELLS OF ELECTROOPTIC DEVICES E INK CORP (US) 2026-01-29 US claimed
US-12515999-B2 Low temperature stable aqueous formulations of N-(n-butyl) thiophosphoric triamide KOCH AGRONOMIC SERVICES, LLC (US) 2026-01-06 US claimed
US-12497534-B2 Sealing film compositions for sealing microcells of electro-optic devices E INK CORPORATION (US) 2025-12-16 US claimed
US-12480048-B2 Etchant TOKYO OHKA KOGYO CO., LTD. (JP) 2025-11-25 US claimed
US-12429777-B2 Photoresist stripper composition for manufacturing display LTC CO., LTD. (KR) 2025-09-30 US claimed
US-20250257242-A1 CMP POLISHING LIQUID AND POLISHING METHOD RESONAC CORPORATION (JP) 2025-08-14 US claimed
US-20250187071-A1 MULTI-PRINCIPAL ELEMENT ALLOY (MPEA) NANOPARTICLES THE JOHNS HOPKINS UNIVERSITY 2025-06-12 US claimed
US-12272560-B2 Selective removal of metal oxide hard masks ENTEGRIS, INC. (US) 2025-04-08 US claimed
CN-115236953-B Stripper composition for removing photoresist and stripping method of photoresist using the same 金�雄 2025-02-25 CN claimed
CN-119495464-A Silver paste composition, preparation method and application thereof 无锡帝科电子材料股份有限公司 2025-02-21 CN claimed
WO-2000043475-A2 DISHWASHING COMPOSITIONS COMPRISING MODIFIED ALKYLBENZENE SULFONATES THE PROCTER & GAMBLE COMPANY (US) 2000-07-27 WO claimed
EP-0989205-A1 METAL PASTE AND METHOD FOR PRODUCTION OF METAL FILM Takamatsu Research Laboratory (JP) 2000-03-29 EP claimed
US-5814113-A Abrasive suspension systems and methods of making the same DIAMOND SCIENTIFIC, INC. (US) 1998-09-29 US claimed
US-5637444-A COMPRISING POLYVINYL ALCOHOL CONTAINING ITACONIC ACID, MALEIC ACID, MALEIC ANHYDRIDE OR ESTER THEREOF AS COPOLYMER COMPONENT AND HAVING SPECIFIED SAPONIFICATION DEGREE, SELECTED HYDROXY COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1997-06-10 US claimed
US-5612303-A HYDROXY OR ETHERIFIED ESTERS NITTO CHEMICAL INDUSTRY CO., LTD. (JP) 1997-03-18 US claimed
US-5610132-A OF TWO DIFFERENT PROPYLENE GLYCOL ALKYL ETHERS AND WATER TOKUYAMA CORPORATION (JP) 1997-03-11 US claimed
US-5512198-A WEAR RESISTANCE NIPPON OIL CO., LTD. (JP) 1996-04-30 US claimed
EP-0412455-B1 Dampening solution for lithographic printing KAO CORP (JP) 1994-11-02 EP claimed
US-5296336-A Water containing propylene oxide or adduct monoetherified with lower alkyl alcohol TOYO INK MANUFACTURING CO., LTD. (JP) 1994-03-22 US claimed
EP-0412455-A1 Dampening solution for lithographic printing KAO CORPORATION (JP) 1991-02-13 EP claimed