SCHEMBL5576981

SCHEMBL5576981

CC(C)(C)OO[SiH](OOC(C)(C)C)OOC(C)(C)C

nearest known ligand 0.50

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6995065 0.74
SCHEMBL28236221 0.69 TDP1 (1.00) TSHRTDP1ALDH1A1
SCHEMBL14861 0.69 TDP1 (1.00) TSHRTDP1ALDH1A1
SCHEMBL9812981 0.67 TSHR (0.39) TSHRTDP1
SCHEMBL10524303 0.67 TSHR (0.73) TSHRTDP1ALDH1A1
Hydrochloric Acid SCHEMBL25381110 0.65 TSHR (0.89) TSHRTDP1ALDH1A1
SCHEMBL7526385 0.65 TSHR (0.89) TSHRTDP1ALDH1A1
Water SCHEMBL2208354 0.65 TSHR (0.89) TSHRTDP1ALDH1A1
SCHEMBL196691 0.65 TSHR (0.89) TSHRTDP1ALDH1A1
SCHEMBL10413085 0.65 TSHR (0.89) TSHRTDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117209772-A Preparation method of lanthanum-containing epoxy polysilsesquioxane 衢州市中通化工有限公司 2023-12-12 CN claimed
CN-116284789-A Preparation method of epoxy lanthanum-containing polysilsesquioxane flame-retardant material 上海普信高分子材料有限公司 2023-06-23 CN claimed
CN-105470392-B A kind of organic inorganic hybridization solar cell and preparation method thereof 苏州大学 2018-01-09 CN claimed
EP-0637902-B1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC (US) 1999-03-31 EP claimed
EP-0637902-A1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC. (US) 1995-02-08 EP claimed
CN-117209772-A Preparation method of lanthanum-containing epoxy polysilsesquioxane 衢州市中通化工有限公司 2023-12-12 CN disclosed
CN-116284789-A Preparation method of epoxy lanthanum-containing polysilsesquioxane flame-retardant material 上海普信高分子材料有限公司 2023-06-23 CN disclosed
CN-113895122-A Tensile breathable winding film and production process thereof 江苏弘奇金属科技有限公司 2022-01-07 CN disclosed
EP-1037511-B1 Surface treatment of copper to prevent microcracking in flexible circuits JX NIPPON MINING & METALS CORP (JP) 2012-07-18 EP disclosed
EP-1749035-A2 POLYMER HAVING A SULFONIC GROUP OR A SULFONATE GROUP AND AN AMIDE GROUP AND METHOD OF PRODUCING SAME Canon Kabushiki Kaisha (JP) 2007-02-07 EP disclosed
US-7045321-B2 POLYHYDROXYALKANOATE CONTAINING UNIT WITH PHENYLSULFANYL STRUCTURE IN THE SIDE CHAIN, PROCESS FOR ITS PRODUCTION, CHARGE CONTROL AGENT, TONER BINDER AND TONER WHICH CONTAIN NOVEL POLYHYDROXYALKANOATE, AND IMAGE-FORMING METHOD AND IMAGE-FORMING APPARATUS WHICH MAKE USE OF THE TONER CANON KABUSHIKI KAISHA (JP) 2006-05-16 US disclosed
WO-2005108441-A2 POLYMER HAVING A SULFONIC GROUP OR A SULFONATE GROUP AND AN AMIDE GROUP AND METHOD OF PRODUCING SAME CANON KABUSHIKI KAISHA (JP) 2005-11-17 WO disclosed
WO-2004041905-A1 NEW POLYHYDROXYALKANOATE COPOLYMER, RESIN COMPOSITION, MOLDED PRODUCT, TONER, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS CANON KABUSHIKI KAISHA (JP) 2004-05-21 WO disclosed
US-6221176-B1 PROVIDING COPPER LAYER; TREATING COPPER LAYER TO PREVENT MICROCRACKING; AFFIXING FIRST SIDE OF COPPER LAYER TO FIRST FLEXIBLE POLYMERIC FILM; PATTERNING COPPER LAYER; AFFIXING SECOND FLEXIBLE POLYMERIC FILM TO SECOND SIDE OF COPPER LAYER GOULD ELECTRONICS, INC. 2001-04-24 US disclosed
EP-1037511-A2 Surface treatment of copper to prevent microcracking in flexible circuits GA-TEK Inc. (US) 2000-09-20 EP disclosed
EP-0637902-B1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC (US) 1999-03-31 EP disclosed
US-5622782-A USEFUL IN MANUFACTURE OF PRINTED CIRCUIT BOARDS GOULD INC. (US) 1997-04-22 US disclosed
EP-0637902-A1 Metallic foil with adhesion promoting layer GOULD ELECTRONICS INC. (US) 1995-02-08 EP disclosed
US-H521-H Thermosetting polysulfones SOLVAY ADVANCED POLYMERS, LLC 1988-09-06 US disclosed
US-4357266-A Flexible resistor compositions SHIN-ETSU POLYMER CO., LTD. (JP) 1982-11-02 US disclosed