⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9445648 | 0.82 | — | — | |
| SCHEMBL28963695 | 0.78 | — | — | |
| SCHEMBL1728215 | 0.78 | — | — | |
| SCHEMBL677150 | 0.78 | — | — | |
| SCHEMBL7603209 | 0.76 | GRIK1 (0.37) | — | |
| SCHEMBL5377593 | 0.75 | GRIK1 (0.42) | — | |
| SCHEMBL26035229 | 0.75 | GRIK1 (0.31) | — | |
| SCHEMBL6729775 | 0.73 | — | — | |
| SCHEMBL9800878 | 0.73 | — | — | |
| SCHEMBL629461 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1234854-B1 | MOLDED OBJECT OF THERMOPLASTIC RESIN AND COMPOSITION | MITSUI CHEMICALS INC (JP) | 2007-01-10 | — | — | EP | disclosed |
| US-6709761-B2 | FROM BLEND OF AN IONOMER (A), WHICH IS A METAL SALT OF A COPOLYMER CONTAINING AN ALPHA -OLEFIN UNIT AND AN UNSATURATED CARBOXYLIC ACID UNIT, AND A RESIN (B) HAVING AN ALICYCLIC STRUCTURE IN ITS MOLECULE. | MITSUI CHEMICALS, INC. (JP) | 2004-03-23 | — | — | US | disclosed |
| US-20020197499-A1 | Molded object of thermoplastic resin and composition | MITSUI CHEMICALS, INC. (JP) | 2002-12-26 | — | — | US | disclosed |
| EP-1234854-A1 | MOLDED OBJECT OF THERMOPLASTIC RESIN AND COMPOSITION | Mitsui Chemicals, Inc. (JP) | 2002-08-28 | — | — | EP | disclosed |
| EP-0348906-B1 | HEAT-RESISTANT RESIN COMPOSITION | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1992-10-07 | — | — | EP | disclosed |
| US-4994515-A | Resin of styrene and unsaturated imide, high impact thermoplastic, bromine-containing reaction product, silicon resin or compound | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1991-02-19 | — | — | US | disclosed |
| EP-0348906-A1 | Heat-resistant resin composition | SHOWA DENKO KABUSHIKI KAISHA (JP) | 1990-01-03 | — | — | EP | disclosed |