SCHEMBL561105

SCHEMBL561105

OC[C@@H]1C2CCC(C2)[C@H]1CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL561437 1.00
SCHEMBL10050522 1.00
SCHEMBL569591 1.00
SCHEMBL1461040 1.00
SCHEMBL278784 1.00
SCHEMBL9605762 1.00
SCHEMBL9606081 1.00
SCHEMBL19860431 1.00
SCHEMBL11421394 1.00
SCHEMBL9904072 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218111-A1 EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME SAMYANG CORPORATION (KR) 2024-07-04 US claimed
EP-4332141-A1 EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME Samyang Corporation (KR) 2024-03-06 EP claimed
EP-2621990-B1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM BLUE CUBE IP LLC (US) 2016-02-24 EP claimed
EP-2621991-B1 PROCESS FOR PREPARING EPOXY RESINS DOW GLOBAL TECHNOLOGIES LLC (US) 2015-07-01 EP claimed
US-8962792-B2 Process for preparing epoxy resins DOW GLOBAL TECHNOLOGIES LLC (US) 2015-02-24 US claimed
US-20140194554-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-07-10 US claimed
US-8729215-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers PROMERUS, LLC (US) 2014-05-20 US claimed
US-20140024799-A1 Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived From Stereospecific Polycyclic 2,3-Diol Monomers PROMERUS, LLC (US) 2014-01-23 US claimed
US-20130302336-A1 DISULFIDE STABILIZED DVD-IG MOLECULES UCB PHARMA S.A. (BE) 2013-11-14 US claimed
US-8575297-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers Promerus, LCC (US) 2013-11-05 US claimed
US-20130237642-A1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2013-09-12 US claimed
EP-2621994-A1 EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP claimed
EP-2621990-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM Dow Global Technologies LLC (US) 2013-08-07 EP claimed
EP-2621991-A1 PROCESS FOR PREPARING EPOXY RESINS Dow Global Technologies LLC (US) 2013-08-07 EP claimed
US-20130178601-A1 PROCESS FOR PREPARING EPOXY RESINS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-11 US claimed
WO-2012047420-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-12 WO claimed
WO-2012044442-A1 PROCESS FOR PREPARING EPOXY RESINS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO claimed
WO-2012044443-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO claimed
US-5773661-A REACTION OF ALKALI METAL PHOSPHIDE WITH DISULFONIC ACID ESTEROF TRANS-2,3-NOBORNANEDIMETHANOL CELANESE INTERNATIONAL CORPORATION (US) 1998-06-30 US claimed
US-20240218111-A1 EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME SAMYANG CORPORATION (KR) 2024-07-04 US disclosed
EP-4332141-A1 EPOXY RESIN WITH IMPROVED WATER RESISTANCE AND COMPOSITION COMPRISING SAME Samyang Corporation (KR) 2024-03-06 EP disclosed
CN-114727856-A Crystallizable resin 阿莱恩技术有限公司 2022-07-08 CN disclosed
US-20210147672-A1 CRYSTALLIZABLE RESINS ALIGN TECHNOLOGY, INC. 2021-05-20 US disclosed
US-9890244-B2 Thermally decomposable polymer compositions incorporating thermally activated base generators SUMITOMO BAKELITE CO., LTD. (JP) 2018-02-13 US disclosed
US-9765200-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2017-09-19 US disclosed
US-9757818-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2017-09-12 US disclosed
US-20170036308-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES PROMERUS, LLC (US) 2017-02-09 US disclosed
US-9505948-B2 Thermally decomposable polymer compositions for forming microelectronic assemblies PROMERUS, LLC (US) 2016-11-29 US disclosed
EP-2621995-B1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-03-23 EP disclosed
US-9284434-B2 Epoxy resin compositions BLUE CUBE IP LLC (US) 2016-03-15 US disclosed
EP-2621990-B1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM BLUE CUBE IP LLC (US) 2016-02-24 EP disclosed
US-20150337081-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS PROMERUS, LLC (US) 2015-11-26 US disclosed
US-20150299509-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS FOR FORMING MICROELECTRONIC ASSEMBLIES PROMERUS, LLC (US) 2015-10-22 US disclosed
EP-2601238-B1 SACRIFICIAL POLYMER COMPOSITIONS INCLUDING POLYCARBONATES HAVING REPEAT UNITS DERIVED FROM STEREOSPECIFIC POLYCYCLIC 2,3-DIOL MONOMERS SUMITOMO BAKELITE CO (JP) 2015-10-07 EP disclosed
WO-2015148039-A1 PARTIALLY HYDROLYZED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2015-10-01 WO disclosed
EP-2649128-B1 POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY PROMERUS LLC (US) 2015-09-30 EP disclosed
US-9115300-B2 Thermally decomposable polymer compositions incorporating thermally activated base generators PROMERUS, LLC 2015-08-25 US disclosed
US-9068039-B2 Thermosettable compositions and thermosets therefrom DOW GLOBAL TECHNOLOGIES LLC (US) 2015-06-30 US disclosed
US-20150152285-A1 ADVANCED EPOXY RESIN COMPOSITIONS BLUE CUBE IP LLC 2015-06-04 US disclosed
US-20140194554-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-07-10 US disclosed
WO-2014099614-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITION FOR FORMING MICROELECTRIC ASSEMBLIES PROMERUS, LLC (US) 2014-06-26 WO disclosed
US-8729215-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers PROMERUS, LLC (US) 2014-05-20 US disclosed
US-20140024799-A1 Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived From Stereospecific Polycyclic 2,3-Diol Monomers PROMERUS, LLC (US) 2014-01-23 US disclosed
US-20130327815-A1 Polymer Composition for Microelectronic Assembly PROMERUS, LLC (US) 2013-12-12 US disclosed
US-20130302336-A1 DISULFIDE STABILIZED DVD-IG MOLECULES UCB PHARMA S.A. (BE) 2013-11-14 US disclosed
US-8575297-B2 Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers Promerus, LCC (US) 2013-11-05 US disclosed
US-8535454-B2 Polymer composition for microelectronic assembly PROMERUS, LLC (US) 2013-09-17 US disclosed
US-20130237642-A1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2013-09-12 US disclosed
EP-2621997-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621995-A1 ADVANCED EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621994-A1 EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621990-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
US-20130178591-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-11 US disclosed
US-20130178590-A1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-11 US disclosed
EP-2601238-A1 SACRIFICIAL POLYMER COMPOSITIONS INCLUDING POLYCARBONATES HAVING REPEAT UNITS DERIVED FROM STEREOSPECIFIC POLYCYCLIC 2,3-DIOL MONOMERS Promerus, LLC (US) 2013-06-12 EP disclosed
US-20120318854-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS PROMERUS LLC (US) 2012-12-20 US disclosed
WO-2012174384-A1 THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS PROMERUS LLC (US) 2012-12-20 WO disclosed
US-20120298729-A1 Polymer Composition for Microelectronic Assembly PROMERUS LLC (US) 2012-11-29 US disclosed
WO-2012050777-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-19 WO disclosed
WO-2012047420-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-12 WO disclosed
WO-2012044458-A1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO disclosed
WO-2012044443-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO disclosed
US-20120031556-A1 Sacrificial Polymer Compositions Including Polycarbonates Having Repeat Units Derived from Stereospecific Polycyclic 2,3-Diol Monomers PROMERUS LLC (US) 2012-02-09 US disclosed
WO-2012019091-A1 SACRIFICIAL POLYMER COMPOSITIONS INCLUDING POLYCARBONATES HAVING REPEAT UNITS DERIVED FROM STEREOSPECIFIC POLYCYCLIC 2,3-DIOL MONOMERS PROMERUS LLC (US) 2012-02-09 WO disclosed
US-5789624-A HYDROFORMYLATION OF ALKENES TO ALDEHYDES USING A RHODIUM COMPLEX CATALYST HOECHST CELANESE CORPORATION (US) 1998-08-04 US disclosed
US-5773661-A REACTION OF ALKALI METAL PHOSPHIDE WITH DISULFONIC ACID ESTEROF TRANS-2,3-NOBORNANEDIMETHANOL CELANESE INTERNATIONAL CORPORATION (US) 1998-06-30 US disclosed
EP-0832087-A1 SYNTHESIS OF AND HYDROFORMYLATION WITH FLUORO-SUBSTITUTED BIDENTATE PHOSPHINE LIGANDS HOECHST CELANESE CORPORATION (US) 1998-04-01 EP disclosed
US-5710338-A FLUOROPHENYLPHOSPHINE LIGANDS FOR CATALYSTS HOECHST CELANESE CORPORATION (US) 1998-01-20 US disclosed
US-5710337-A RHODIUM COMPLEX OF BIS PHOSPHINE HOECHST CELANESE CORPORATION (US) 1998-01-20 US disclosed
US-5616785-A BIS/3,5-DIFLUOROPHENYL/PHOSPHINE OXIDE AND BIS/3,5-DIFLUOROPHENYL/-PHOSPHINOUS ACID; CHEMICAL INTERMEDIATES FOR FLUORO-SUBSTITUTED BIDENTATE PHOSPHINE LIGANDS HOECHST CELANESE CORPORATION (US) 1997-04-01 US disclosed
WO-1996038456-A1 SYNTHESIS OF AND HYDROFORMYLATION WITH FLUORO-SUBSTITUTED BIDENTATE PHOSPHINE LIGANDS HOECHST CELANESE CORPORATION (US) 1996-12-05 WO disclosed
US-5567856-A USING A RHODIUM COMPLEX CATALYST HOECHST CELANESE CORPORATION (US) 1996-10-22 US disclosed
US-4216331-A Use of chiral rhodium-diphosphine catalyst capable of catalytic reduction of a tetramisole precursor to give a significant excess of the desired S-(-) isomer levamisole AMERICAN CYANAMID COMPANY (US) 1980-08-05 US disclosed
US-4166824-A Chiral rhodium-diphosphine catalyst capable of catalytic reduction of a tetramisole precursor to give a significant excess of the desired S-(-)isomer, levamisole AMERICAN CYANAMID COMPANY (US) 1979-09-04 US disclosed
US-4166824-A Chiral rhodium-diphosphine catalyst capable of catalytic reduction of a tetramisole precursor to give a significant excess of the desired S-(-)isomer, levamisole AMERICAN CYANAMID COMPANY (US) 1979-09-04 US disclosed