Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 2/20 | 0.43 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
| ▸ | BBOX1 | O75936 | 3/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.39 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | TP53 | P04637 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.39 |
| ▸ | GMNN | O75496 | 1/20 | 0.39 |
| ▸ | THPO | P40225 | 1/20 | 0.39 |
| ▸ | HBB | P68871 | 1/20 | 0.39 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.39 |
| ▸ | RECQL | P46063 | 2/20 | 0.32 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | ENPEP | Q07075 | 2/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | BLM | P54132 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20533801 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| Zinc Ion SCHEMBL6912620 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL20533539 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL20533645 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL20533674 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL20533537 | 0.93 | — | — | |
| SCHEMBL22581627 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL20533804 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL1086920 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 | |
| SCHEMBL6916974 | 0.93 | MAPT (0.43) | MAPTKDM4EALOX15BBOX1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 345 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024131535-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| WO-2024131536-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-118241266-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118241267-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-117684223-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117684222-A | Metal electroplating composition for electrolytic copper coating and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| WO-2024046450-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-03-07 | — | — | WO | claimed |
| WO-2024046447-A1 | METAL ELECTROPLATING COMPOSITION FOR ELECTROLYTIC COPPER COATING AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-03-07 | — | — | WO | claimed |
| CN-112746292-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112725851-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112725851-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-04-30 | — | — | CN | claimed |
| US-8268155-B1 | Copper electroplating solutions with halides | NOVELLUS SYSTEMS, INC. (US) | 2012-09-18 | — | — | US | claimed |
| US-8043967-B2 | Process for through silicon via filling | NOVELLUS SYSTEMS, INC. (US) | 2011-10-25 | — | — | US | claimed |
| US-7776741-B2 | Process for through silicon via filing | NOVELLUS SYSTEMS, INC. (US) | 2010-08-17 | — | — | US | claimed |
| US-20100200412-A1 | Process For Through Silicon Via Filling | NOVELLUS SYSTEMS, INC. | 2010-08-12 | — | — | US | claimed |
| WO-2010022009-A2 | PROCESS FOR THROUGH SILICON VIA FILLING | NOVELLUS SYSTEMS, INC. (US) | 2010-02-25 | — | — | WO | claimed |
| US-20100041226-A1 | Process For Through Silicon Via Filing | NOVELLUS SYSTEMS, INC. | 2010-02-18 | — | — | US | claimed |
| EP-1338031-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2003-08-27 | — | — | EP | claimed |
| WO-2002045142-A9 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORP (US) | 2003-02-06 | — | — | WO | claimed |
| WO-2002045142-A2 | COPPER ALLOY INTERCONNECTIONS FOR INTEGRATED CIRCUITS AND METHODS OF MAKING SAME | INTEL CORPORATION (US) | 2002-06-06 | — | — | WO | claimed |