⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20158364 | 0.70 | — | — | |
| SCHEMBL301646 | 0.70 | — | — | |
| SCHEMBL2406364 | 0.69 | — | — | |
| SCHEMBL2498622 | 0.69 | — | — | |
| SCHEMBL4662373 | 0.69 | — | — | |
| SCHEMBL4661290 | 0.69 | — | — | |
| Hydrochloric Acid SCHEMBL4661103 | 0.67 | — | — | |
| Hydrochloric Acid SCHEMBL6523340 | 0.67 | — | — | |
| Hydrochloric Acid SCHEMBL4662292 | 0.67 | — | — | |
| SCHEMBL8863757 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2019142208-A1 | AMBIENT TEMPERATURE CURABLE NON-ISOCYANATE POLYHYDROXYALKYLURETHANE MOIETIES WITH ALDEHYDE CROSS LINKER | Asian Paints Ltd. (IN) | 2019-07-25 | — | — | WO | claimed |
| EP-2486078-B1 | A LATENT CURING AGENT AND EPOXY COMPOSITIONS CONTAINING THE SAME | HENKEL AG & CO KGAA (DE) | 2018-02-21 | — | — | EP | claimed |
| US-9334426-B2 | Latent curing agent and epoxy compositions containing the same | HENKEL AG & CO. KGAA (DE) | 2016-05-10 | — | — | US | claimed |
| US-20140235738-A1 | LATENT CURING AGENT AND EPOXY COMPOSITIONS CONTAINING THE SAME | HENKEL AG & CO. KGAA (DE) | 2014-08-21 | — | — | US | claimed |
| US-20120238653-A1 | LATENT CURING AGENT AND EPOXY COMPOSITIONS CONTAINING THE SAME | HENKEL AG & CO. KGAA (DE) | 2012-09-20 | — | — | US | claimed |
| EP-2486078-A1 | A LATENT CURING AGENT AND EPOXY COMPOSITIONS CONTAINING THE SAME | Henkel AG & Co. KGaA (DE) | 2012-08-15 | — | — | EP | claimed |
| US-20120031846-A1 | METHOD FOR COLLECTING OIL WITH MODIFIED CLAY | NATIONAL TAIWAN UNIVERSITY (TW) | 2012-02-09 | — | — | US | claimed |
| WO-2011042062-A1 | A LATENT CURING AGENT AND EPOXY COMPOSITIONS CONTAINING THE SAME | HENKEL AG & CO. KGAA (DE) | 2011-04-14 | — | — | WO | claimed |
| EP-1755384-A1 | MICROCAPSULES HAVING ACTIVATED RELEASE OF CORE MATERIAL THEREIN | Monsanto Technology, LLC (US) | 2007-02-28 | — | — | EP | claimed |
| EP-1112389-B1 | PROCESS FOR RECOVERY OF GOLD AND/OR SILVER | ORETEK LTD (AU) | 2006-03-15 | — | — | EP | claimed |
| WO-2005122758-A1 | MICROCAPSULES HAVING ACTIVATED RELEASE OF CORE MATERIAL THEREIN | MONSANTO TECHNOLOGY LLC (US) | 2005-12-29 | — | — | WO | claimed |
| US-20050277549-A1 | Microcapsules having activated release of core material therein | MONSANTO TECHNOLOGY LLC (US) | 2005-12-15 | — | — | US | claimed |
| WO-1995009201-A1 | POLYEUREA MODIFIED UNSATURATED POLYESTER COMPOSITIONS | CAMBRIDGE INDUSTRIES, INC. (US) | 1995-04-06 | — | — | WO | claimed |
| EP-4397492-A1 | ADHESIVE, LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND PACKAGING MATERIAL | DIC Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| WO-2023100828-A1 | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | ＥＮＥＯＳ株式会社 | 2023-06-08 | — | — | WO | disclosed |
| US-20230151138-A1 | STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OBTAINED BY CURING CURABLE COMPOSITION | ENEOS CORPORATION (JP) | 2023-05-18 | — | — | US | disclosed |
| US-5508340-A | Water-based, solvent-free or low voc, two-component polyurethane coatings | R. E. HART LABS, INC. (US) | 1996-04-16 | — | — | US | disclosed |
| EP-0700945-A1 | Water-based, solvent-free or low voc, two-component polyurethane coatings | R.E. HART LABS, INC. (US) | 1996-03-13 | — | — | EP | disclosed |
| US-5171769-A | Molding materials; protective coatings, dielectric for electronics | CIBA-GEIGY CORPORATION (US) | 1992-12-15 | — | — | US | disclosed |
| US-4764537-A | KETIMINE, ALDIMINE, ENAMINE OR CYCLIC SCHIFF BASE, METAL SALT OF CARBOXYLIC ACID | BASF AKTIENGESELLSCHAFT (DE) | 1988-08-16 | — | — | US | disclosed |