SCHEMBL562877

SCHEMBL562877

CCCCP(O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28390108 0.97
SCHEMBL9714448 0.90
SCHEMBL10769717 0.87 TSHR (0.50)
SCHEMBL29790906 0.87 TSHR (0.50)
SCHEMBL1725841 0.87 TSHR (0.50)
SCHEMBL2517669 0.87 TSHR (0.50)
SCHEMBL2515238 0.87 TSHR (0.50)
SCHEMBL2514547 0.87 TSHR (0.50)
SCHEMBL2991283 0.87
SCHEMBL11054188 0.87 TSHR (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3998305-B1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME TORAY INDUSTRIES (JP) 2025-03-12 EP disclosed
US-11629243-B2 Polyamide resin composition and molded article obtained by molding same TORAY INDUSTRIES, INC. (JP) 2023-04-18 US disclosed
CN-114144473-B Polyamide resin composition and molded article obtained by molding same 东丽株式会社 2023-01-03 CN disclosed
US-20220204729-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME TORAY INDUSTRIES, INC. (JP) 2022-06-30 US disclosed
EP-3998305-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME Toray Industries, Inc. (JP) 2022-05-18 EP disclosed
CN-114144473-A Polyamide resin composition and molded article obtained by molding same 东丽株式会社 2022-03-04 CN disclosed
EP-3369778-B1 MOLDED ARTICLE COMPRISING RESIN COMPOSITION CONTAINING POLYAMIDE RESIN TORAY INDUSTRIES (JP) 2020-09-30 EP disclosed
US-20180312692-A1 MOLDED PRODUCT MADE FROM RESIN COMPOSITION INCLUDING POLYAMIDE RESIN TORAY INDUSTRIES, INC. (JP) 2018-11-01 US disclosed
EP-3369778-A1 MOLDED ARTICLE COMPRISING RESIN COMPOSITION CONTAINING POLYAMIDE RESIN Toray Industries, Inc. (JP) 2018-09-05 EP disclosed
US-9273017-B2 (Thio)morpholine derivatives as S1P modulators ABBVIE BAHAMAS LIMITED (BS) 2016-03-01 US disclosed
US-5190934-A Treatment of cognitive and memory disorders CIBA-GEIGY CORPORATION (US) 1993-03-02 US disclosed
US-5064819-A Antidepressants, anxiolytic agents, GABA antagonists CIBA-GEIGY CORPORATION (US) 1991-11-12 US disclosed
US-5051524-A Treatment of a phosphinic acid with an anhydrous protic medium CIBA-GEIGY CORPORATION (US) 1991-09-24 US disclosed
EP-0128006-B1 A SOIL-DISEASE-CONTROLLING AGENT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1991-09-18 EP disclosed
US-5013863-A Learning enhancement CIBA-GEIGY CORPORATION (US) 1991-05-07 US disclosed
EP-0402312-A2 P-substituted propane-phosphinic acid compounds CIBA-GEIGY AG (CH) 1990-12-12 EP disclosed
EP-0319479-A2 Substituted propane-phosphinic acid compounds CIBA-GEIGY AG (CH) 1989-06-07 EP disclosed
EP-0319482-A2 Novel substituted propane phosphinic acid compounds CIBA-GEIGY AG (CH) 1989-06-07 EP disclosed
US-4709052-A FUNGICIDES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-11-24 US disclosed
US-4396556-A REACTING A 2-HALOACETAMIDE WITH A PHOSPHONATE, PHOSPHINATE, OR PHOSPHINE OXIDE IN A TWO-PHASE LIQUID SYSTEM OCCIDENTAL RESEARCH CORPORATION (US) 1983-08-02 US disclosed