Acetic Acid

Acetic Acid

SCHEMBL563776

CC(=O)[O-].CC(=O)[O-].N.N.N.N.[Pd+2]

nearest known ligand 0.80

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.80
CA4 P22748 3/20 0.54
LMNA P02545 2/20 0.46
TSHR P16473 2/20 0.42
FFAR3 O14843 2/20 0.42
THPO P40225 1/20 0.42
LCK P06239 1/20 0.42
FYN P06241 1/20 0.42
ALOX15 P16050 1/20 0.39
BLM P54132 1/20 0.39
PMP22 Q01453 1/20 0.39
FAHD1 Q6P587 1/20 0.39
ALDH1A1 P00352 3/20 0.33
HDAC3 O15379 1/20 0.33
HDAC1 Q13547 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC8 Q9BY41 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
KDM4E B2RXH2 1/20 0.33
CA2 P00918 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL1807958 1.00 CA1 (0.80) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL3308697 1.00 CA1 (0.80) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL8027888 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL28308129 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL19518030 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL29827597 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL711 0.95
Acetic Acid SCHEMBL3805081 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL3432478 0.95 CA1 (0.89) CA1CA4LMNATSHRFFAR3
Acetic Acid SCHEMBL25229790 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024788-B1 Bonding copper wire plated with palladium and gold and electroplating process thereof SHANGHAI WONSUNG ALLOY MATERIAL CO., LTD. (CN) 2024-07-02 US claimed
CN-116024021-A Method for preparing biomass-based fuel component and biomass-based fuel component 中国石油化工股份有限公司 2023-04-28 CN claimed
CN-109897070-B Preparation method of tetraamminepalladium acetate (II) 徐州浩通新材料科技股份有限公司 2021-06-18 CN claimed
US-20120034550-A1 Palladium-Platinum Nanostructures And Methods For Their Preparation WASHINGTON UNIVERSITY IN ST. LOUIS (US) 2012-02-09 US claimed
WO-2010123896-A2 PALLADIUM-PLATINUM NANOSTRUCTURES AND METHODS FOR THEIR PREPARATION WASHINGTON UNIVERSITY (US) 2010-10-28 WO claimed
US-20090075157-A1 Carbon nanotube for fuel cell, nanocomposite comprising the same, method for making the same, and fuel cell using the same THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 2009-03-19 US claimed
WO-2006080702-A1 CARBON NANOTUBE FOR FUEL CELL, NANOCOMPISITE COMPRISING THE SAME, METHOD FOR MAKING THE SAME, AND FUEL CELL USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-08-03 WO claimed
EP-2703077-B1 OFF GAS PURIFICATION DEVICE N E CHEMCAT CORP (JP) 2025-01-08 EP disclosed
WO-2025000356-A1 PALLADIUM-PLATED GOLD-BONDED COPPER WIRE AND ELECTROPLATING PROCESS THEREFOR 上海万生合金材料有限公司 2025-01-02 WO disclosed
EP-3476480-B1 CATALYST FOR LEAN BURN N E CHEMCAT CORP (JP) 2024-08-28 EP disclosed
US-12024788-B1 Bonding copper wire plated with palladium and gold and electroplating process thereof SHANGHAI WONSUNG ALLOY MATERIAL CO., LTD. (CN) 2024-07-02 US disclosed
US-12024788-B1 Bonding copper wire plated with palladium and gold and electroplating process thereof SHANGHAI WONSUNG ALLOY MATERIAL CO., LTD. (CN) 2024-07-02 US disclosed
US-11946144-B2 Electroless palladium plating solution C. UYEMURA & CO., LTD. (JP) 2024-04-02 US disclosed
US-20080176129-A1 Nanocomposite for fuel cell, method of preparing the nanocomposite, and fuel cell including the nanocomposite SAMSUNG SDI CO., LTD. (KR) 2008-07-24 US disclosed
US-7314768-B2 Formation method of electroconductive pattern, and production method of electron-emitting device, electron source, and image display apparatus using this CANON KABUSHIKI KAISHA (JP) 2008-01-01 US disclosed
US-7307040-B2 Method for the selective production of tetrahydrofuran by hydrogenating maleic acid anhydride BASF AKTIENGESELLSCHAFT (DE) 2007-12-11 US disclosed
WO-2006080702-A1 CARBON NANOTUBE FOR FUEL CELL, NANOCOMPISITE COMPRISING THE SAME, METHOD FOR MAKING THE SAME, AND FUEL CELL USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-08-03 WO disclosed
US-20060127696-A1 Rhodium and iridium complexes COVION ORGANIC SEMICONDUCTORS GMBH (DE) 2006-06-15 US disclosed
US-20050266589-A1 Formation method of electroconductive pattern, and production method of electron-emitting device, electron source, and image display apparatus using this CANON KABUSHIKI KAISHA (JP) 2005-12-01 US disclosed
US-20040198596-A1 Method for the selective production of tetrahydrofuran by hydrogenating maleic acid anhydride BASF AKTIENGESELLSCHAFT (DE) 2004-10-07 US disclosed