⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28212369 | 1.00 | — | — | |
| SCHEMBL27824129 | 0.82 | — | — | |
| SCHEMBL11118524 | 0.82 | — | — | |
| SCHEMBL27511427 | 0.82 | — | — | |
| SCHEMBL9494068 | 0.82 | — | — | |
| SCHEMBL936745 | 0.82 | — | — | |
| SCHEMBL11196503 | 0.82 | — | — | |
| SCHEMBL8907576 | 0.82 | — | — | |
| SCHEMBL10960045 | 0.82 | — | — | |
| SCHEMBL27783475 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1665 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260088584-A1 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | TAIWAN ASIA SEMICONDUCTOR CORP (TW) | 2026-03-26 | — | — | US | claimed |
| EP-4716035-A1 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Taiwan-Asia Semiconductor Corporation (TW) | 2026-03-25 | — | — | EP | claimed |
| US-20260020389-A1 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | TAIWAN ASIA SEMICONDUCTOR CORP (TW) | 2026-01-15 | — | — | US | claimed |
| US-12433068-B2 | LED with ALGAINP window layer | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD (CN) | 2025-09-30 | — | — | US | claimed |
| CN-119525640-B | High-reliability semiconductor laser array packaging structure preparation clamp and packaging structure preparation method applying same | 苏州长光华芯光电技术股份有限公司 | 2025-05-30 | — | — | CN | claimed |
| CN-119542923-B | Semiconductor laser bar stacked array and packaging method thereof | 苏州长光华芯光电技术股份有限公司 | 2025-04-18 | — | — | CN | claimed |
| CN-119746331-A | Fire prevention is with spray thrower and fire control spraying system | 福建紫消建设有限公司 | 2025-04-04 | — | — | CN | claimed |
| CN-119677240-A | Evanescent wave coupling type sub-terahertz single-row carrier photoelectric detector | 上海科技大学 | 2025-03-21 | — | — | CN | claimed |
| CN-119546000-A | Light emitting diode | 台亚半导体股份有限公司 | 2025-02-28 | — | — | CN | claimed |
| CN-119525640-A | High-reliability semiconductor laser array packaging structure preparation clamp and packaging structure preparation method applying same | 苏州长光华芯光电技术股份有限公司 | 2025-02-28 | — | — | CN | claimed |
| US-4692993-A | Schottky barrier charge coupled device (CCD) manufacture | HUGHES ELECTRONICS CORPORATION | 1987-09-15 | — | — | US | claimed |
| US-4665413-A | Edge junction schottky diode | EATON CORPORATION (US) | 1987-05-12 | — | — | US | claimed |
| US-H170-H | Self aligned notch for InP planar transferred electron oscillator | UNITED STATES OF AMERICA (US) | 1986-12-02 | — | — | US | claimed |
| US-4613890-A | Alloyed contact for n-conducting GaAlAs-semi-conductor material | TELEFUNKEN ELECTRONIC GMBH (DE) | 1986-09-23 | — | — | US | claimed |
| US-4499656-A | Deep mesa process for fabricating monolithic integrated Schottky barrier diode for millimeter wave mixers | SPERRY CORPORATION (US) | 1985-02-19 | — | — | US | claimed |
| US-4312112-A | Method of making field-effect transistors with micron and submicron gate lengths | EATON CORPORATION (US) | 1982-01-26 | — | — | US | claimed |
| US-4310570-A | Field-effect transistors with micron and submicron gate lengths | EATON CORPORATION (US) | 1982-01-12 | — | — | US | claimed |
| US-4075650-A | MILLIMETER WAVE SEMICONDUCTOR DEVICE | CUTLER-HAMMER, INC. (US) | 1978-02-21 | — | — | US | claimed |
| US-3986251-A | Germanium doped light emitting diode bonding process | MOTOROLA, INC. (US) | 1976-10-19 | — | — | US | claimed |
| US-3941916-A | Electronic circuit package and method of brazing | BURROUGHS CORPORATION (US) | 1976-03-02 | — | — | US | claimed |