SCHEMBL5647074

SCHEMBL5647074

C[SiH](O[Si](C)(O[SiH](C)c1ccccc1)c1ccccc1)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5650143 0.92 ESR1 (0.31) ESR1ESR2
SCHEMBL28490406 0.89
SCHEMBL19220473 0.87
SCHEMBL3843028 0.87
SCHEMBL12680911 0.87
SCHEMBL20912526 0.86
SCHEMBL20912531 0.86
SCHEMBL6414974 0.84
SCHEMBL12680906 0.84
SCHEMBL15672949 0.83 ESR1 (0.33) ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112442174-A Radiation-resistant phenyl silicone rubber and preparation method and application thereof 北京化工大学 2021-03-05 CN claimed
CN-111378208-A Graphene heat conduction material and preparation method thereof 广州奥翼材料与器件研究院有限公司 2020-07-07 CN claimed
CN-111286308-A Graphene heat-conducting silicone grease and preparation method thereof 广州奥翼材料与器件研究院有限公司 2020-06-16 CN claimed
CN-110894361-B Photocuring packaging composition, packaging structure and semiconductor device 浙江福斯特新材料研究院有限公司 2022-02-25 CN disclosed
CN-112442174-A Radiation-resistant phenyl silicone rubber and preparation method and application thereof 北京化工大学 2021-03-05 CN disclosed
CN-111378208-A Graphene heat conduction material and preparation method thereof 广州奥翼材料与器件研究院有限公司 2020-07-07 CN disclosed
CN-111286308-A Graphene heat-conducting silicone grease and preparation method thereof 广州奥翼材料与器件研究院有限公司 2020-06-16 CN disclosed
CN-110894361-A Photocuring packaging composition, packaging structure and semiconductor device 浙江福斯特新材料研究院有限公司 2020-03-20 CN disclosed
EP-2924085-B1 COMPOSITION FOR ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY MANUFACTURED USING THE SAME SAMSUNG SDI CO LTD (KR) 2019-05-08 EP disclosed
US-9893307-B2 Composition for encapsulation of organic light emitting diode and organic light emitting diode display manufactured using the same SAMSUNG SDI CO., LTD. (KR) 2018-02-13 US disclosed
US-20150280151-A1 COMPOSITION FOR ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY MANUFACTURED USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2015-10-01 US disclosed
EP-2924085-A1 Composition for encapsulation of organic light emitting diode and organic light emitting diode display manufactured using the same Samsung SDI Co., Ltd. (KR) 2015-09-30 EP disclosed
CN-103524740-A Preparation method of methyl phenyl hydroxyl silicone oil with low tetracyclic compound content UNIV HANGZHOU NORMAL 2014-01-22 CN disclosed
US-7211543-B2 Photocatalyst composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2007-05-01 US disclosed
CN-1301795-C Photocatalyst composition ASAHI CHEMICAL IND (JP) 2007-02-28 CN disclosed
US-20050227859-A1 Photocatalyst composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2005-10-13 US disclosed
CN-1638868-A Photocatalyst composition ASAHI CHEMICAL IND (JP) 2005-07-13 CN disclosed
EP-1518601-A1 PHOTOCATALYST COMPOSITION Asahi Kasei Kabushiki Kaisha (JP) 2005-03-30 EP disclosed
US-6175031-B1 PLATINUM-CATALYZED HYDROSILYLATION BETWEEN SIH-SUBSTITUTED SILICON COMPOUNDS AND UNSATURATED GROUP-FUNCTIONAL ORGANIC OR ORGANOSILICON COMPOUNDS IN PRESENCE OF A (ACYLOXY)-FUNCTIONAL HYDROGENSILANE COMPOUND OR ACID AND HYDRO(ALKOXY)SILANE DOW CORNING ASIA, LTD. (JP) 2001-01-16 US disclosed