⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8768662 | 1.00 | — | — | |
| SCHEMBL10831535 | 0.87 | — | — | |
| SCHEMBL3422382 | 0.87 | — | — | |
| SCHEMBL7261563 | 0.87 | — | — | |
| SCHEMBL16026574 | 0.87 | — | — | |
| SCHEMBL1292894 | 0.87 | — | — | |
| SCHEMBL5772075 | 0.87 | — | — | |
| SCHEMBL5918899 | 0.87 | — | — | |
| SCHEMBL3444819 | 0.87 | — | — | |
| SCHEMBL15843892 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5552 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118339639-A | NH radical thermal nitridation for forming metal silicon nitride film | 应用材料公司 | 2024-07-12 | — | — | CN | claimed |
| CN-118248627-A | Damascus process, semiconductor integrated circuit structure, polishing process and wafer | 季华实验室 | 2024-06-25 | — | — | CN | claimed |
| US-20240172420-A1 | VERTICAL DIGIT LINES FOR SEMICONDUCTOR DEVICES | MICRON TECHNOLOGY, INC. | 2024-05-23 | — | — | US | claimed |
| CN-117995765-A | Method for improving aluminum-copper alloy hole filling | 上海华虹宏力半导体制造有限公司 | 2024-05-07 | — | — | CN | claimed |
| WO-2024089221-A1 | INTEGRATED OPTICAL SENSOR FOR DIFFUSE REFLECTANCE SPECTROSCOPY | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2024-05-02 | — | — | WO | claimed |
| CN-113764452-B | Pixel unit structure and forming method thereof | 上海集成电路装备材料产业创新中心有限公司 | 2024-04-26 | — | — | CN | claimed |
| US-20240098970-A1 | VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN 3D MEMORY | MICRON TECHNOLOGY, INC. | 2024-03-21 | — | — | US | claimed |
| US-20240098969-A1 | SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN VERTICAL | MICRON TECHNOLOGY, INC. | 2024-03-21 | — | — | US | claimed |
| US-20240064956-A1 | VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH VERTICAL ACCESS LINES | MICRON TECHNOLOGY, INC. | 2024-02-22 | — | — | US | claimed |
| US-20240064966-A1 | VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH HORIZONTAL ACCESS LINES | MICRON TECHNOLOGY, INC. | 2024-02-22 | — | — | US | claimed |
| US-5430328-A | Process for self-align contact | UNITED MICROELECTRONICS CORPORATION (TW) | 1995-07-04 | — | — | US | claimed |
| EP-0269095-B1 | Integrated semiconductor circuit with at least two planes made of aluminium or aluminium compound and method of manufacturing the same | SIEMENS AG (DE) | 1994-02-16 | — | — | EP | claimed |
| EP-0282226-B1 | HIGH SPEED INTERCONNECT SYSTEM WITH REFRACTORY NON-DOGBONE CONTACTS AND AN ACTIVE ELECTROMIGRATION SUPPRESSION MECHANISM | ADVANCED MICRO DEVICES, INC. (US) | 1992-12-16 | — | — | EP | claimed |
| EP-0280089-B1 | PROCESS FOR THE MANUFACTURE OF A TITANIUM/TITANIUM NITRIDE DOUBLE LAYER FOR USE AS A CONTACT AND BARRIER LAYER IN VERY LARGE SCALE INTEGRATED CIRCUITS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-04-03 | — | — | EP | claimed |
| US-4962060-A | PATTERNED REFRACTORY CORE; SIDEWALL SPACERS | ADVANCED MICRO DEVICES, INC. (US) | 1990-10-09 | — | — | US | claimed |
| US-4924295-A | CORROSION RESISTANCE, HIGH CURRENT DENSITY, MINIATURIZATION | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-05-08 | — | — | US | claimed |
| US-4910580-A | Method for manufacturing a low-impedance, planar metallization composed of aluminum or of an aluminum alloy | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-03-20 | — | — | US | claimed |
| US-4847674-A | SEMICONDUCTORS | ADVANCED MICRO DEVICES, INC. (US) | 1989-07-11 | — | — | US | claimed |
| EP-0282226-A2 | High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism | ADVANCED MICRO DEVICES, INC. (US) | 1988-09-14 | — | — | EP | claimed |
| US-4052738-A | STYLUS FOR CAPACITIVE VIDEODISC | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JA) | 1977-10-04 | — | — | US | claimed |