SCHEMBL5699205

SCHEMBL5699205

C/C=C/CNCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13249524 1.00
SCHEMBL2113375 1.00
Hydrochloric Acid SCHEMBL22771588 0.97
Hydrochloric Acid SCHEMBL22771589 0.97
SCHEMBL15478935 0.86
SCHEMBL562701 0.83 KDM1A (0.63)
SCHEMBL562702 0.83 KDM1A (0.63)
SCHEMBL37332 0.83
SCHEMBL37331 0.83
SCHEMBL19237332 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108369907-B Liquid composition and method for surface treatment of semiconductor substrate using same 三菱瓦斯化学株式会社 2022-09-20 CN claimed
US-11094526-B2 Liquid composition for imparting alcohol-repellency to semiconductor substrate material, and method for treating surface of semiconductor substrate using said liquid composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-08-17 US claimed
EP-3404700-B1 LIQUID COMPOSITION FOR IMPARTING ALCOHOL-REPELLENCY TO SEMICONDUCTOR SUBSTRATE MATERIAL, AND METHOD FOR TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAID LIQUID COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2020-05-13 EP claimed
US-20190019672-A1 LIQUID COMPOSITION FOR IMPARTING ALCOHOL-REPELLENCY TO SEMICONDUCTOR SUBSTRATE MATERIAL, AND METHOD FOR TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAID LIQUID COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2019-01-17 US claimed
EP-3404700-A1 LIQUID COMPOSITION FOR IMPARTING ALCOHOL-REPELLENCY TO SEMICONDUCTOR SUBSTRATE MATERIAL, AND METHOD FOR TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE USING SAID LIQUID COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2018-11-21 EP claimed
US-20240027902-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-25 US disclosed
US-11774853-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-03 US disclosed
US-20230305394-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-20230305393-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-20230161252-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 US disclosed
WO-2023091707-A1 BICYCLIC INHIBITORS OF JAK AND METHODS OF USE THERAVANCE BIOPHARMA R&D IP, LLC (US) 2023-05-25 WO disclosed
CN-108369907-B Liquid composition and method for surface treatment of semiconductor substrate using same 三菱瓦斯化学株式会社 2022-09-20 CN disclosed
US-5892125-A REACTING 1,3-BUTADIENE WITH AN AMINE; ISOMERIZATION BASF AKTIENGESELLSCHAFT (DE) 1999-04-06 US disclosed
EP-0778819-B1 PROCESS FOR PRODUCING N-BUTYRALDEHYDE AND/OR N-BUTANOL BASF AG (DE) 1999-01-13 EP disclosed
EP-0778819-A1 PROCESS FOR PRODUCING N-BUTYRALDEHYDE AND/OR N-BUTANOL BASF AKTIENGESELLSCHAFT (DE) 1997-06-18 EP disclosed
WO-1996007630-A1 PROCESS FOR PRODUCING N-BUTYRALDEHYDE AND/OR N-BUTANOL BASF AKTIENGESELLSCHAFT (DE) 1996-03-14 WO disclosed
US-4409224-A Pyrimido[1,6-a]indole derivatives AMERICAN HOME PRODUCTS CORP. (US) 1983-10-11 US disclosed
US-4307234-A Pyrimido[1,6-a]indole derivatives AMERICAN HOME PRODUCTS CORP. (US) 1981-12-22 US disclosed
WO-1980000537-A1 PYRIMIDO(1,6-A)INDOLE DERIVATIVES AMERICAN HOME PROD (US) 1980-04-03 WO disclosed
EP-0008950-A2 Pyrimido(1,6-a)indole derivatives and intermediates therefor, processes for their preparation, pharmaceutical compositions containing the derivatives and their use AMERICAN HOME PRODUCTS CORPORATION (US) 1980-03-19 EP disclosed