SCHEMBL5705462

SCHEMBL5705462

[Cu].[Ni].[Ti].[Zr]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28836613 0.89
SCHEMBL28022251 0.89
SCHEMBL2152836 0.89
SCHEMBL28018970 0.89
SCHEMBL22987040 0.89
SCHEMBL31156729 0.89
SCHEMBL578578 0.87
SCHEMBL25617 0.87
SCHEMBL10888389 0.87
SCHEMBL29203047 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113714584-B Connecting method and auxiliary tool for titanium-aluminum compound turbine and steel shaft 中国航发北京航空材料研究院 2022-11-22 CN claimed
CN-113732424-B Method for improving connection quality of silicon carbide-niobium brazing by aid of low-expansion 4J42 alloy interlayer auxiliary brazing filler metal 哈尔滨工业大学 2022-08-02 CN claimed
CN-113732424-A Method for improving silicon carbide-niobium brazing connection quality through low-expansion 4J42 alloy middle layer auxiliary brazing filler metal 哈尔滨工业大学 2021-12-03 CN claimed
CN-113714584-A Connecting method and auxiliary tool for titanium-aluminum compound turbine and steel shaft 中国航发北京航空材料研究院 2021-11-30 CN claimed
US-20180133849-A1 TI-BASED FILLER ALLOY COMPOSITIONS LEE, DONGMYOUNG 2018-05-17 US claimed
CN-103949742-B A kind of sapphire sheet and metal active method for sealing GANSU HONGGUANG ELECTRICAL CO., LTD. (CN) 2016-02-10 CN claimed
WO-2014169133-A1 TI-BASED FILLER ALLOY COMPOSITIONS CASE WESTERN RESERVE UNIVERSITY (US) 2014-10-16 WO claimed
CN-103949742-A Method for actively sealing sapphire sheet and metal GANSU HONGGUANG ELECTRICAL CO LTD 2014-07-30 CN claimed
CN-117226342-B Design method and use method of welding material for Mo-containing high-temperature titanium alloy 中国航发北京航空材料研究院 2025-04-11 CN disclosed
CN-119589046-A Titanium alloy current-assisted vacuum brazing tool and process method 江苏科技大学 2025-03-11 CN disclosed
CN-116197572-B Brazing filler metal ring powder for brazing of aircraft titanium alloy guide tube and preparation method thereof 国营芜湖机械厂 2024-11-22 CN disclosed
CN-114749746-B Reaction brazing process for connecting graphite and molybdenum alloy by Ti/Zr foil 合肥工业大学 2024-01-23 CN disclosed
CN-117226342-A Design method and use method of welding material for Mo-containing high-temperature titanium alloy 中国航发北京航空材料研究院 2023-12-15 CN disclosed
CN-116984779-A Titanium-based brazing alloy particles, preparation method thereof and titanium cup brazing process 杭州哈尔斯实业有限公司 2023-11-03 CN disclosed
EP-1272681-B1 GOLD-INDIUM SUPERELASTIC ALLOY AND ARTICLES THEREFROM HONEYWELL INT INC (US) 2006-09-27 EP disclosed
CN-1695877-A Method for preparing powder of titanium based alloyl solder BEIJING AVIAT MATERIAL I CHINA (CN) 2005-11-16 CN disclosed
EP-1272681-A2 GOLD-INDIUM SUPERELASTIC ALLOY AND ARTICLES THEREFROM Honeywell International, Inc. (US) 2003-01-08 EP disclosed
US-6500282-B2 Gold-indium intermetallic compound, shape memory alloys formed therefrom and resulting articles HONEYWELL INTERNATIONAL INC. 2002-12-31 US disclosed
WO-2001073145-A2 GOLD-INDIUM SUPERELASTIC ALLOY AND ARTICLES THEREFROM HONEYWELL INTERNATIONAL INC. (US) 2001-10-04 WO disclosed
US-20010026770-A1 Gold-indium intermetallic compound, shape memory alloys formed therefrom and resulting articles HONEYWELL INTERNATIONAL INC. 2001-10-04 US disclosed