SCHEMBL5709879

SCHEMBL5709879

CCCCC(CC)COC(=O)CC(O)C(=O)O

nearest known ligand 0.64

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 4/20 0.64
TSHR P16473 3/20 0.64
TDP1 Q9NUW8 2/20 0.64
ATM Q13315 1/20 0.64
RECQL P46063 1/20 0.61
ALDH1A1 P00352 5/20 0.49
CA2 P00918 3/20 0.49
MAPK1 P28482 4/20 0.47
LMNA P02545 3/20 0.45
HSD17B10 Q99714 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
PRSS1 P07477 1/20 0.43
PRSS2 P07478 1/20 0.43
PRSS3 P35030 1/20 0.43
GPR84 Q9NQS5 3/20 0.43
FFAR1 O14842 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL475612 0.89 RECQL (0.67) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL30557846 0.88 RECQL (0.65) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL28246238 0.85 CYP3A4 (0.74) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL17816196 0.84 CYP3A4 (0.64) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL5420738 0.84 CYP3A4 (0.68) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL5420740 0.84 CYP3A4 (0.68) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL28958329 0.84 CYP3A4 (0.59) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL1155390 0.83 CYP3A4 (0.77) CYP3A4TSHRTDP1ATMRECQL
SCHEMBL27587426 0.83 CYP3A4 (0.66) CYP3A4TSHRTDP1ATMRECQL
Propionic Acid SCHEMBL28575585 0.82 CYP3A4 (0.70) CYP3A4TSHRTDP1ATMRECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920009-B2 Thermosetting resin composition, sheet-molding compound and production method therefor, and fiber-reinforced composite material MITSUBISHI CHEMICAL CORPORATION (JP) 2021-02-16 US disclosed
EP-3441409-B1 THERMOSETTING RESIN COMPOSITION, SHEET-MOLDING COMPOUND AND PRODUCTION METHOD THEREFOR, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI CHEM CORP (JP) 2020-06-03 EP disclosed
EP-3441409-A1 THERMOSETTING RESIN COMPOSITION, SHEET-MOLDING COMPOUND AND PRODUCTION METHOD THEREFOR, AND FIBER-REINFORCED COMPOSITE MATERIAL Mitsubishi Chemical Corporation (JP) 2019-02-13 EP disclosed
US-20190031817-A1 THERMOSETTING RESIN COMPOSITION, SHEET-MOLDING COMPOUND AND PRODUCTION METHOD THEREFOR, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2019-01-31 US disclosed
EP-1285773-B1 Transfer sheets SEIKO EPSON CORP (JP) 2006-12-27 EP disclosed
EP-1266766-B1 Transfer sheets DAICEL CHEM (JP) 2005-12-28 EP disclosed
US-6953614-B2 Transfer sheets DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-10-11 US disclosed
US-6878423-B2 Transfer sheets DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-12 US disclosed
US-20040081774-A1 Transfer sheet for ink jet printer which is so excellent in ink-absorption that stain transfer does not occur; water resistance, washing resistance DAICEL CHEMICAL INDUSTRIES, LTD. 2004-04-29 US disclosed
US-6716494-B2 Transfer sheets SEIKO EPSON CORPORATION (JP) 2004-04-06 US disclosed
US-20030203146-A1 Transfer sheets DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-10-30 US disclosed
EP-1356953-A1 Transfer sheets Daicel Chemical Industries, Ltd. (JP) 2003-10-29 EP disclosed
US-20030068477-A1 Transfer sheets SEIKO EPSON CORPORATION (JP) 2003-04-10 US disclosed
EP-0803531-B1 Waterproof material and method for applying it MITSUI CHEMICALS INC (JP) 2003-03-19 EP disclosed
EP-1285773-A1 Transfer sheets SEIKO EPSON CORPORATION (JP) 2003-02-26 EP disclosed
US-20030008114-A1 Transfer image to substrate; using hot melt adhesive DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-01-09 US disclosed
EP-1266766-A1 Transfer sheets Daicel Chemical Industries, Ltd. (JP) 2002-12-18 EP disclosed
US-5935683-A LAMINATING MANY SHEETS OF A PHOTO-SETTING TYPE FIBER REINFORCED THERMOSETTING RESIN, A PHOTOPOLYMERIZATION INITIATOR AND A THICKENER, AND A FIBER REINFORCED MATERIAL MITSUI CHEMICALS, INC. (JP) 1999-08-10 US disclosed
EP-0861862-A2 Method for reinforcing structures Mitsubishi Chemical Corporation (JP) 1998-09-02 EP disclosed
EP-0803531-A2 Waterproof material and method for applying it MITSUI TOATSU CHEMICALS, INC. (JP) 1997-10-29 EP disclosed