⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9191731 | 1.00 | — | — | |
| SCHEMBL4359963 | 1.00 | — | — | |
| SCHEMBL25598 | 1.00 | — | — | |
| SCHEMBL10535773 | 1.00 | — | — | |
| SCHEMBL3657165 | 1.00 | — | — | |
| SCHEMBL10537729 | 1.00 | — | — | |
| SCHEMBL19137409 | 1.00 | — | — | |
| SCHEMBL11521893 | 1.00 | — | — | |
| SCHEMBL7626201 | 1.00 | — | — | |
| SCHEMBL29869559 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117733648-B | Cutting temperature testing method and system adopting sheet insulating thermocouple | 上海交通大学 | 2026-05-12 | — | — | CN | claimed |
| CN-117733648-A | Cutting temperature testing method and system adopting sheet insulating thermocouple | 上海交通大学 | 2024-03-22 | — | — | CN | claimed |
| CN-115479981-A | Screen printing electrode and preparation method and application thereof | 广东朗源生物科技有限公司 | 2022-12-16 | — | — | CN | claimed |
| CN-115352147-A | Heat-conducting copper-based electromagnetic shielding material and synthesis process thereof | 宁波恒浩广新型电子材料有限公司 | 2022-11-18 | — | — | CN | claimed |
| CN-114629380-A | Electric air conditioner and thermoelectric power generation system based on conductive polymer composite material | 华中科技大学 | 2022-06-14 | — | — | CN | claimed |
| CN-114361150-A | Surface mounting device and display module | 京东方科技集团股份有限公司 | 2022-04-15 | — | — | CN | claimed |
| US-20260136990-A1 | SEMICONDUCTOR DEVICES HAVING DUMMY DIES AND METHODS OF MAKING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING CO LIMITED (TW) | 2026-05-14 | — | — | US | disclosed |
| CN-117733648-B | Cutting temperature testing method and system adopting sheet insulating thermocouple | 上海交通大学 | 2026-05-12 | — | — | CN | disclosed |
| CN-121586156-A | Cross-line connection structure and circuit module | 中国移动通信集团终端有限公司 | 2026-02-27 | — | — | CN | disclosed |
| CN-121034712-A | High-strength high-elongation copper-nickel-copper composite foil and preparation process thereof | 江西华创新材有限公司 | 2025-11-28 | — | — | CN | disclosed |
| CN-121034712-A | High-strength high-elongation copper-nickel-copper composite foil and preparation process thereof | 江西华创新材有限公司 | 2025-11-28 | — | — | CN | disclosed |
| CN-119824386-A | Thermocouple and preparation method thereof | 广东先导稀材股份有限公司 | 2025-04-15 | — | — | CN | disclosed |
| CN-222720407-U | Semiconductor package | 台湾积体电路制造股份有限公司 | 2025-04-04 | — | — | CN | disclosed |
| EP-1086776-A1 | Laminated ribbon and method and apparatus for producing same | HITACHI METALS, LTD. (JP) | 2001-03-28 | — | — | EP | disclosed |
| EP-0871983-A1 | METHOD OF MANUFACTURING ELECTRODES BY GAS ATOMISATION OF MOLTEN METALS | British Ceramic Research Limited (GB) | 1998-10-21 | — | — | EP | disclosed |
| WO-1997025750-A1 | METHOD OF MANUFACTURING ELECTRODES BY GAS ATOMISATION OF MOLTEN METALS | BRITISH CERAMIC RESEARCH LIMITED (GB) | 1997-07-17 | — | — | WO | disclosed |
| CN-2056814-U | Multi-core coaxial rubber socket | JIANHULI SPECIAL RUBBER FACTOR (CN) | 1990-05-09 | — | — | CN | disclosed |
| US-4618504-A | Method and apparatus for applying metal cladding on surfaces and products formed thereby | BOSNA ALEXANDER A | 1986-10-21 | — | — | US | disclosed |
| US-4521475-A | Method and apparatus for applying metal cladding on surfaces and products formed thereby | RICCIO LOUIS M (US) | 1985-06-04 | — | — | US | disclosed |
| US-3957086-A | ELECTRODEPOSITED COPPER OR NICKEL PROTECTIVE COATING | BUNDY CORPORATION (US) | 1976-05-18 | — | — | US | disclosed |