Boric Acid

Boric Acid

SCHEMBL5724772

NCCNCCN.OB(O)O

nearest known ligand 0.71

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 5/20 0.71
CA6 P23280 5/20 0.71
CA7 P43166 5/20 0.71
CA9 Q16790 5/20 0.71
CA14 Q9ULX7 5/20 0.71
CA5B Q9Y2D0 5/20 0.71
MEN1 O00255 2/20 0.71
RECQL P46063 2/20 0.71
KMT2A Q03164 2/20 0.71
CA2 P00918 4/20 0.67
CA4 P22748 4/20 0.67
CA5A P35218 4/20 0.67
LMNA P02545 3/20 0.67
CA3 P07451 3/20 0.67
ALOX15 P16050 3/20 0.67
TDP1 Q9NUW8 2/20 0.67
CA1 P00915 2/20 0.67
ALDH1A1 P00352 1/20 0.67
TP53 P04637 1/20 0.67
KDM4E B2RXH2 1/20 0.62

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trientine SCHEMBL5725004 0.97 CA12 (0.73) CA12CA6CA7CA9CA14
Boric Acid SCHEMBL5725134 0.97 CA12 (0.73) CA12CA6CA7CA9CA14
Boric Acid SCHEMBL31379799 0.88 CA12 (0.56) CA12CA6CA7CA9CA14
SCHEMBL5314937 0.84 CA12 (1.00) CA12CA6CA7CA9CA14
SCHEMBL15381 0.84
Spermine SCHEMBL28303945 0.84 CA12 (0.77) CA12CA6CA7CA9CA14
Spermidine SCHEMBL29135304 0.82 CA12 (0.78) CA12CA6CA7CA9CA14
Methyl Alcohol SCHEMBL28111848 0.81
SCHEMBL25342018 0.81 CA12 (1.00) CA12CA6CA7CA9CA14
Trientine SCHEMBL15439 0.81 CA12 (1.00) CA12CA6CA7CA9CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119638858-A Cationic guar gum and preparation method thereof 广州天赐高新材料股份有限公司 2025-03-18 CN claimed
CN-119638858-A Cationic guar gum and preparation method thereof 广州天赐高新材料股份有限公司 2025-03-18 CN disclosed
CN-112376091-B Preparation method of alloy electroplating solution 峨山金峰金属制品有限责任公司 2023-05-05 CN disclosed
CN-100366656-C Epoxy resin composition and method for producing heat-resistant laminate KAWAMURA INST CHEM RES (JP) 2008-02-06 CN disclosed
US-20060247334-A1 Epoxy resin composition and method for producing heat-resistant laminate sheet KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2006-11-02 US disclosed
CN-1829757-A Epoxy resin composition and method for producing heat-resistant laminate sheet KAWAMURA INST CHEM RES (JP) 2006-09-06 CN disclosed
EP-1652869-A1 EPOXY RESIN COMPOSITION AND METHOD FOR PRODUCING HEAT-RESISTANT LAMINATE SHEET KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2006-05-03 EP disclosed