Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | GMNN | O75496 | 1/20 | 0.35 |
| ▸ | PPM1B | O75688 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.35 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | PPP5C | P53041 | 1/20 | 0.35 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.35 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.35 |
| ▸ | THPO | P40225 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19670812 | 1.00 | KDM4E (0.35) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL18193415 | 1.00 | KDM4E (0.35) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL19441377 | 1.00 | KDM4E (0.35) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL19285855 | 0.85 | — | — | |
| SCHEMBL13191796 | 0.85 | — | — | |
| SCHEMBL3197692 | 0.84 | KDM4E (0.38) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL13483371 | 0.84 | KDM4E (0.38) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL3197687 | 0.84 | KDM4E (0.38) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL21500160 | 0.82 | KDM4E (0.41) | KDM4EGMNNPPM1BLMNAPPP1CC | |
| SCHEMBL12573997 | 0.76 | KDM4E (0.33) | KDM4EGMNNPPM1BLMNAPPP1CC |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11066510-B2 | Epoxy resin composition, process for producing same, and uses of said composition | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2021-07-20 | — | — | US | claimed |
| EP-3321302-B1 | EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2021-06-30 | — | — | EP | claimed |
| US-20200283566-A1 | EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2020-09-10 | — | — | US | claimed |
| CN-107849223-B | Epoxy resin composition, process for producing the same, and use of the same | 住友精化株式会社 | 2020-07-28 | — | — | CN | claimed |
| US-20190119434-A1 | EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2019-04-25 | — | — | US | claimed |
| EP-4722269-A1 | RESIN COMPOSITION | Daicel Corporation (JP) | 2026-04-08 | — | — | EP | disclosed |
| CN-120202243-A | Thermosetting resin composition, cured film, substrate, and electronic component | 捷恩智株式会社 | 2025-06-24 | — | — | CN | disclosed |
| WO-2024247925-A1 | RESIN COMPOSITION | 株式会社ダイセル | 2024-12-05 | — | — | WO | disclosed |
| WO-2024150597-A1 | THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE, AND ELECTRONIC COMPONENT | JNC株式会社 | 2024-07-18 | — | — | WO | disclosed |
| US-20220155688-A1 | ALKALINE DEVELOPER SOLUABLE SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2022-05-19 | — | — | US | disclosed |
| US-11066510-B2 | Epoxy resin composition, process for producing same, and uses of said composition | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2021-07-20 | — | — | US | disclosed |
| EP-3321302-B1 | EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2021-06-30 | — | — | EP | disclosed |
| WO-2012018684-A1 | ENCAPSULATING RESIN COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2012-02-09 | — | — | WO | disclosed |
| WO-2011142403-A1 | RADIATION-SENSITIVE RESIN COMPOSITION FOR IMMERSION EXPOSURE, CURING PATTERN FORMING METHOD AND CURING PATTERN | JSR株式会社 (JP) | 2011-11-17 | — | — | WO | disclosed |
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008098189-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-14 | — | — | WO | disclosed |
| US-7199205-B2 | Organopolysiloxane-modified polysaccharide and process for producing the same | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 2007-04-03 | — | — | US | disclosed |
| US-7199205-B2 | Organopolysiloxane-modified polysaccharide and process for producing the same | DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) | 2007-04-03 | — | — | US | disclosed |
| US-3956353-A | SILANE COMPOUND | DOW CORNING CORPORATION (US) | 1976-05-11 | — | — | US | disclosed |