⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28045257 | 1.00 | — | — | |
| SCHEMBL28316151 | 1.00 | — | — | |
| SCHEMBL28105617 | 1.00 | — | — | |
| SCHEMBL3296468 | 0.82 | — | — | |
| SCHEMBL3296690 | 0.82 | — | — | |
| Phosphine SCHEMBL28595687 | 0.82 | — | — | |
| SCHEMBL28787722 | 0.82 | — | — | |
| SCHEMBL11481779 | 0.82 | — | — | |
| Water SCHEMBL10488899 | 0.82 | — | — | |
| SCHEMBL8195809 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5610 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122070793-A | Direct bonded semiconductor die package | 沃孚半导体公司 | 2026-05-19 | — | — | CN | claimed |
| US-20260133329-A1 | DOUBLE LIGHT OUTPUT SCINTILLATION STRUCTURE FOR SCINTIGRAPHIC INVESTIGATIONS | CONSIGLIO NAZ DELLE RICERCHE (IT) | 2026-05-14 | — | — | US | claimed |
| US-20260023186-A1 | MEASURING STRUCTURE FOR PET AND SPECT APPLICATIONS | CONSIGLIO NAZIONALE RICERCHE (IT) | 2026-01-22 | — | — | US | claimed |
| EP-4562454-A1 | MEASURING STRUCTURE FOR PET AND SPECT APPLICATIONS | Consiglio Nazionale Delle Ricerche (IT) | 2025-06-04 | — | — | EP | claimed |
| CN-120073560-A | Insulation full-automatic stripping equipment suitable for stripping wire aluminum wire layer | 青海送变电工程有限公司 | 2025-05-30 | — | — | CN | claimed |
| CN-119944186-A | Solid-state soft package battery PACK module | 江苏华友能源科技有限公司 | 2025-05-06 | — | — | CN | claimed |
| WO-2025085331-A1 | DIRECT BONDED SEMICONDUCTOR DIE PACKAGE | WOLFSPEED, INC. (US) | 2025-04-24 | — | — | WO | claimed |
| US-20250125231-A1 | Direct Bonded Semiconductor Die Package | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT | 2025-04-17 | — | — | US | claimed |
| CN-119581226-B | Film capacitor with good heat conduction effect | 南通成晟电子实业有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-119581226-A | Film capacitor with good heat conduction effect | 南通成晟电子实业有限公司 | 2025-03-07 | — | — | CN | claimed |
| CN-85200132-U | PMOS LOW-HIGH VOLTAGE SWITCHING CIRCUIT | — | 1985-12-20 | — | — | CN | claimed |
| EP-0146452-A2 | Pulse-width control of bonding ball formation | FAIRCHILD SEMICONDUCTOR CORPORATION (US) | 1985-06-26 | — | — | EP | claimed |
| US-4482794-A | Pulse-width control of bonding ball formation | FAIRCHILD CAMERA & INSTRUMENT CORPORATION (US) | 1984-11-13 | — | — | US | claimed |
| US-4388001-A | Electronic timepiece | CITIZEN WATCH CO., LTD. (JP) | 1983-06-14 | — | — | US | claimed |
| EP-0044048-A1 | Glass passivated high power semiconductor devices | WESTINGHOUSE ELECTRIC CORPORATION (US) | 1982-01-20 | — | — | EP | claimed |
| US-4168960-A | Method of making a glass encapsulated diode | WESTINGHOUSE ELECTRIC CORP. (US) | 1979-09-25 | — | — | US | claimed |
| US-4164461-A | Semiconductor integrated circuit structures and manufacturing methods | RAYTHEON COMPANY (US) | 1979-08-14 | — | — | US | claimed |
| US-4121241-A | Multilayer interconnected structure for semiconductor integrated circuit | RAYTHEON COMPANY (US) | 1978-10-17 | — | — | US | claimed |
| US-4107726-A | ALUMINUM LAYERS | RAYTHEON COMPANY (US) | 1978-08-15 | — | — | US | claimed |
| US-3969207-A | Method for the cyclic electrochemical processing of sulfuric acid-containing pickle waste liquors | LICENCIA TALALMANYOKAT ERTEKESITO VALLALAT (HU) | 1976-07-13 | — | — | US | claimed |