SCHEMBL575225

SCHEMBL575225

CCCOP(=O)(OCC)OCCC

nearest known ligand 0.72

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.72
CYP3A4 P08684 3/20 0.59
ALDH1A1 P00352 1/20 0.43
TP53 P04637 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
PPARD Q03181 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.35
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
CA9 Q16790 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Triethyl Phosphate SCHEMBL10784239 1.00 TSHR (0.72) TSHRCYP3A4ALDH1A1TP53TDP1
SCHEMBL575634 1.00 TSHR (0.72) TSHRCYP3A4ALDH1A1TP53TDP1
Ammonia Solution, Strong SCHEMBL28281310 0.97 TSHR (0.68) TSHRCYP3A4ALDH1A1TP53TDP1
SCHEMBL104844 0.91 CYP3A4 (0.68) TSHRCYP3A4ALDH1A1MEN1KMT2A
SCHEMBL575195 0.91 CYP3A4 (0.77) TSHRCYP3A4
SCHEMBL3820273 0.89 CYP3A4 (0.67) TSHRCYP3A4
SCHEMBL8962338 0.88 TSHR (0.81) TSHRCYP3A4ALDH1A1TP53TDP1
Ammonia Solution, Strong SCHEMBL11326091 0.88 CYP3A4 (0.65) TSHRCYP3A4ALDH1A1MEN1KMT2A
SCHEMBL31023525 0.88 CYP3A4 (0.65) TSHRCYP3A4ALDH1A1MEN1KMT2A
Methane SCHEMBL28409090 0.88 CYP3A4 (0.65) TSHRCYP3A4ALDH1A1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 308 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025103116-A1 SHRINKAGE-RESISTANT POLYPHENYLENE ETHER COMPOSITION, PREPARATION METHOD THEREFOR AND USE THEREOF 金发科技股份有限公司 2025-05-22 WO claimed
CN-117624868-B Anti-shrinkage polyphenyl ether composition, and preparation method and application thereof 金发科技股份有限公司 2025-03-25 CN claimed
CN-117624868-A Anti-shrinkage polyphenyl ether composition, and preparation method and application thereof 金发科技股份有限公司 2024-03-01 CN claimed
CN-116731411-A Halogen-free flame-retardant polyolefin elastomer material, and preparation method and application thereof 芜湖鼎汉轨道交通装备有限公司 2023-09-12 CN claimed
WO-2022110671-A1 POLYPHENYLENE ETHER COMPOSITION HAVING HIGH HOT WIRE IGNITION PERFORMANCE, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF 金发科技股份有限公司 2022-06-02 WO claimed
CN-112375367-B High-thermal-filament ignition polyphenyl ether composition and preparation method and application thereof 金发科技股份有限公司 2022-05-06 CN claimed
CN-114181512-A Polyphenyl ether composite material and preparation method and application thereof 金发科技股份有限公司 2022-03-15 CN claimed
CN-112375367-A High-thermal-filament ignition polyphenyl ether composition and preparation method and application thereof 金发科技股份有限公司 2021-02-19 CN claimed
EP-3259298-A1 FLAME RETARDANT THERMOSET COMPOSITIONS FRX Polymers, Inc. (US) 2017-12-27 EP claimed
CN-107250205-A flame retardant thermoset composition FRX 聚合物股份有限公司 2017-10-13 CN claimed
US-20160244607-A1 FLAME RETARDANT THERMOSET COMPOSITIONS FRX POLYMERS, INC. 2016-08-25 US claimed
WO-2016134369-A1 FLAME RETARDANT THERMOSET COMPOSITIONS FRX POLYMERS, INC. (US) 2016-08-25 WO claimed
CN-102219978-A Halogen-free flame-retardant polyolefin elastomer composition for wire and cable covering material DONGGUAN CHUANGMENG ELECTRONICS CO LTD 2011-10-19 CN claimed
US-7524894-B2 Resin composition for wire and cable covering material SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-04-28 US claimed
CN-1314757-C Resin composition for wire and cable covering material GEN ELECTRIC (US) 2007-05-09 CN claimed
US-20060014843-A1 Vapor pressure depressant and use thereof DAIHACHI CHEMICAL INDUSTRY CO., LTD. (JP) 2006-01-19 US claimed
EP-1561793-A1 VAPOR PRESSURE DEPRESSANT AND USE THEREOF Daihachi Chemical Industry Co., Ltd. (JP) 2005-08-10 EP claimed
US-20040102551-A1 Resin composition for wire and cable covering material SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2004-05-27 US claimed
EP-3992243-B1 METHACRYLIC RESIN COMPOSITION, MOLDED ARTICLE OF SAME, AND METHOD FOR PRODUCING FILM KURARAY CO (JP) 2025-11-12 EP disclosed
US-4049561-A EXTREME PRESSURE ADDITIVE SELECTED FROM A PARTIAL AMIDE OF A DI- OR TRI-CARBOXYLIC ACID, A THIOETHER, AND A HYDROCARBYL PHOSPHATE CHEVRON RESEARCH COMPANY (US) 1977-09-20 US disclosed