SCHEMBL581375

SCHEMBL581375

CC1CCCCC1(C)[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL581206 0.92
SCHEMBL766223 0.77
SCHEMBL21936312 0.74
SCHEMBL3899073 0.74
SCHEMBL5932604 0.74
SCHEMBL11280434 0.72
SCHEMBL201821 0.72
SCHEMBL5932351 0.70
SCHEMBL3713513 0.70 GAA (0.34)
SCHEMBL3035968 0.70 GAA (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 289 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107963982-B Polyisocyanate composition and isocyanate polymer composition 旭化成株式会社 2021-11-12 CN claimed
CN-118215651-A Method for producing isocyanate compound, method for producing urethane compound, method for recovering amine compound, and isocyanate composition 旭化成株式会社 2024-06-18 CN disclosed
WO-2024071129-A1 ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND BUILD-UP FILM 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
US-11807711-B2 Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-11-07 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
WO-2023162552-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
EP-2435497-B1 POLYCYCLIC DITHIOPHENES CLAP CO LTD (KR) 2023-07-05 EP disclosed
US-5516920-A POLYMER STABILIZERS CIBA-GEIGY CORPORATION (US) 1996-05-14 US disclosed
US-5457204-A For polymers CIBA-GEIGY CORPORATION (US) 1995-10-10 US disclosed
EP-0648765-A1 Process for the production of 3-arylbenzofuranones CIBA-GEIGY AG (CH) 1995-04-19 EP disclosed
EP-0638597-A1 Polymeric adults of hindered amine-epoxydes as stabilizers CIBA-GEIGY AG (CH) 1995-02-15 EP disclosed
EP-0634399-A1 Adducts of hindered amine-epoxides as stabilisers CIBA-GEIGY AG (CH) 1995-01-18 EP disclosed
EP-0634449-A2 Polyether with sterically hindered amine side chains as stabilizing agents CIBA-GEIGY AG (CH) 1995-01-18 EP disclosed
EP-0634450-A2 Polyether with releasably bound sterically hindered amines as stabilizing agents CIBA-GEIGY AG (CH) 1995-01-18 EP disclosed
US-5340701-A Photoinitiators CIBA-GEIGY CORPORATION (US) 1994-08-23 US disclosed
EP-0565488-A1 Fluorine free titanocenes and their application CIBA-GEIGY AG (CH) 1993-10-13 EP disclosed
EP-0373643-A2 Near infrared absorbers and display/recording materials prepared by using same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-20 EP disclosed