SCHEMBL582020

SCHEMBL582020

SCCSC(S)CCSCCC(S)SCCS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4389610 0.97
SCHEMBL459598 0.83
SCHEMBL16666846 0.76
SCHEMBL2149515 0.74
SCHEMBL28838075 0.72
SCHEMBL21197635 0.70
SCHEMBL16289848 0.70
SCHEMBL434413 0.69
SCHEMBL28430990 0.67
SCHEMBL28839608 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2016050786-A1 COSMETIC PROCESS FOR ATTENUATING WRINKLES L'OREAL (FR) 2016-04-07 WO claimed
WO-2016050788-A1 COSMETIC PROCESS FOR ATTENUATING WRINKLES L'OREAL (FR) 2016-04-07 WO claimed
WO-2024135400-A1 CURABLE RESIN COMPOSITION AND PROCESSED PRODUCT OF SAME 株式会社スリーボンド 2024-06-27 WO disclosed
WO-2024095924-A1 PHOTOCURABLE COMPOSITION FOR NAILS OR ARTIFICIAL NAILS 株式会社スリーボンド 2024-05-10 WO disclosed
WO-2024095925-A1 PHOTOCURABLE COMPOSITION FOR NAILS OR ARTIFICIAL NAILS 株式会社スリーボンド 2024-05-10 WO disclosed
WO-2023085159-A1 PHOTOCURABLE COMPOSITION FOR NAILS OR ARTIFICIAL NAILS 株式会社スリーボンド 2023-05-19 WO disclosed
WO-2023085157-A1 PHOTOCURABLE COMPOSITION 株式会社スリーボンド 2023-05-19 WO disclosed
WO-2022136110-A1 COSMETIC COMPOSITION COMPRISING POLYMER PARTICLES BASED ON ACETOACETATE FUNCTIONS L'OREAL (FR) 2022-06-30 WO disclosed
EP-2418235-B1 PHOTOCURABLE RESIN COMPOSITION FOR ULTRAVIOLET LED IRRADIATION Henkel IP & Holding GmbH (DE) 2019-03-13 EP disclosed
WO-2017036504-A1 WRINKLE-REDUCING COSMETIC METHOD L'OREAL (FR) 2017-03-09 WO disclosed
WO-2016050788-A1 COSMETIC PROCESS FOR ATTENUATING WRINKLES L'OREAL (FR) 2016-04-07 WO disclosed
US-8288451-B2 Photo-curable resin composition for ultraviolet light-LED irradiation HENKEL CORPORATION (US) 2012-10-16 US disclosed
EP-2418235-A1 PHOTOCURABLE RESIN COMPOSITION FOR ULTRAVIOLET LED IRRADIATION Henkel Corporation (US) 2012-02-15 EP disclosed
US-8044235-B2 (Meth) acryloyl group-containing aromatic isocyanate compound and production process thereof SHOWA DENKO K.K. (JP) 2011-10-25 US disclosed
US-20110230585-A1 PHOTO-CURABLE RESIN COMPOSITION FOR ULTRAVIOLET LIGHT-LED IRRADIATION HENKEL CORPORATION (US) 2011-09-22 US disclosed
US-20090054543-A1 (Meth) Acryloyl Group-Containing Aromatic Isocyanate Compound and Production Process Thereof SHOWA DENKO K.K. (JP) 2009-02-26 US disclosed
US-7338984-B2 Resin composition containing ultrafine inorganic particle MITSUI CHEMICALS, INC. (JP) 2008-03-04 US disclosed
EP-1544220-B1 RESIN COMPOSITION CONTAINING ULTRAFINE INORGANIC PARTICLE MITSUI CHEMICALS INC (JP) 2007-01-10 EP disclosed
US-20050261406-A1 Resin composition containing ultrafine inorganic particle MITSUI CHEMICALS, INC. (JP) 2005-11-24 US disclosed
EP-1544220-A1 RESIN COMPOSITION CONTAINING ULTRAFINE INORGANIC PARTICLE Mitsui Chemicals, Inc. (JP) 2005-06-22 EP disclosed