SCHEMBL5834653

SCHEMBL5834653

CCCS(=O)(=O)OCCCS(=O)(=O)O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 12/20 0.39
CA2 P00918 12/20 0.39
APP P05067 1/20 0.38
CA9 Q16790 9/20 0.38
CA12 O43570 3/20 0.36
CA7 P43166 3/20 0.36
CA14 Q9ULX7 3/20 0.36
CA3 P07451 2/20 0.36
CA4 P22748 2/20 0.36
CA6 P23280 2/20 0.36
CA5A P35218 2/20 0.36
CA5B Q9Y2D0 2/20 0.36
RECQL P46063 2/20 0.35
TSHR P16473 2/20 0.35
EPHX2 P34913 2/20 0.35
BLM P54132 2/20 0.35
GLA P06280 1/20 0.35
HPGD P15428 1/20 0.35
MAPK1 P28482 1/20 0.35
LMNA P02545 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28180126 0.89 CA1 (0.36) CA1CA2APPCA9CA12
SCHEMBL575488 0.84 CA1 (0.46) CA1CA2CA9CA12CA7
SCHEMBL575702 0.84 CA1 (0.50) CA1CA2CA9CA12CA7
SCHEMBL8840309 0.83 CA1 (0.48) CA1CA2APPCA9CA12
SCHEMBL2384810 0.82 CA1 (0.56) CA1CA2CA9CA12CA7
SCHEMBL28064400 0.81 CA1 (0.40) CA1CA2CA9CA12CA7
SCHEMBL29170917 0.80 APP (0.42) CA1CA2APPCA9CA12
SCHEMBL8713647 0.80 CA1 (0.58) CA1CA2CA9CA12CA7
SCHEMBL11979583 0.80 APP (0.42) CA1CA2APPCA9CA12
Ethylene SCHEMBL27491736 0.80 CA1 (0.39) CA1CA2APPCA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117858938-A Method for producing granules or powder containing complexing agent 巴斯夫欧洲公司 2024-04-09 CN disclosed
US-7064068-B2 Method to improve planarity of electroplated copper TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2006-06-20 US disclosed
US-20050164495-A1 Method to improve planarity of electroplated copper TAIWAN SEMICONDUCTOR MANUFACTURING CO. 2005-07-28 US disclosed
US-4483799-A SULFOALKYLATING AGENTS AGFA-GEVAERT AKTIENGESELLSCHAFT (DE) 1984-11-20 US disclosed