SCHEMBL5837137

SCHEMBL5837137

COC(=O)CC1(C(=O)O)CC2C=CC1C2

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35
KARS1 Q15046 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5836559 0.88 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL5837412 0.85 TSHR (0.33) CYP2D6CYP2C19
SCHEMBL11759558 0.85 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5837507 0.85 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL11755667 0.85 CYP2D6 (0.36) CYP2D6CYP2C19
SCHEMBL5836953 0.84 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL5836976 0.83 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL5837911 0.83 CYP2D6 (0.35) CYP2D6CYP2C19
SCHEMBL5837608 0.83 TSHR (0.37) CYP2D6CYP2C19
SCHEMBL11757692 0.82 CYP2D6 (0.36) CYP2D6CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110366704-B Radiation-sensitive resin composition and electronic component 日本瑞翁株式会社(JP) 2023-01-13 CN disclosed
CN-111770964-B Resin composition and electronic component 日本瑞翁株式会社 2022-12-02 CN disclosed
CN-108885398-B Radiation-sensitive resin composition and electronic component 日本瑞翁株式会社 2022-11-29 CN disclosed
CN-114402258-A Radiation-sensitive resin composition 日本瑞翁株式会社 2022-04-26 CN disclosed
US-11169440-B2 Radiation-sensitive resin composition and electronic component ZEON CORPORATION (JP) 2021-11-09 US disclosed
EP-3345970-B1 RESIN COMPOSITION ZEON CORP (JP) 2021-07-28 EP disclosed
CN-107922742-B Resin composition 日本瑞翁株式会社 2021-01-15 CN disclosed
CN-107207868-B Resin composition, resin film, and electronic component 日本瑞翁株式会社 2020-11-06 CN disclosed
CN-111770964-A Resin composition and electronic component 日本瑞翁株式会社 2020-10-13 CN disclosed
US-10775697-B2 Radiation-sensitive resin composition, resin film, and electronic device ZEON CORPORATION (JP) 2020-09-15 US disclosed
US-20170017155-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2017-01-19 US disclosed
US-20160297181-A1 LAMINATE ZEON CORPORATION (JP) 2016-10-13 US disclosed
US-20160209744-A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2016-07-21 US disclosed
US-20160202607-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2016-07-14 US disclosed
US-20160200914-A1 RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2016-07-14 US disclosed
US-20140087136-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD ZEON CORPORATION (JP) 2014-03-27 US disclosed
CN-100386357-C Norbornene-based ring-opening polymerization polymer, product of hydrogenation of norbornene-based ring-opening polymerization polymer, and processes for producing these ZEON CORP (JP) 2008-05-07 CN disclosed
US-7037993-B2 Norbornene-based ring-opening polymerization polymer, product of hydrogenation of norbornene-based ring-opening polymerization polymer, and processes for producing these ZEON CORPORATION (JP) 2006-05-02 US disclosed
CN-1659205-A Norbornene-based ring-opening polymer, hydrogenation product of norbornene-based ring-opening polymer, and method for producing same ZEON CORP (JP) 2005-08-24 CN disclosed
US-20050148746-A1 Norbornene-based ring-opening polymerization polymer, product of hydrogenation of norbornene-based ring-opening polymerization polymer, and processes for producing these ZEON CORPORATION (JP) 2005-07-07 US disclosed