SCHEMBL584882

SCHEMBL584882

Cc1ccc(C2=CC(=O)NC2=O)c(C2=CC(=O)NC2=O)c1C

nearest known ligand 0.46

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TDP2 O95551 1/20 0.46
NSD2 O96028 1/20 0.46
HSP90AA1 P07900 1/20 0.46
PAX8 Q06710 1/20 0.46
POLB P06746 2/20 0.31
RECQL P46063 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
CES1 P23141 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9064309 0.86 POLB (0.39) TDP2NSD2HSP90AA1PAX8POLB
SCHEMBL29576325 0.81 CES1 (0.36) TDP2NSD2HSP90AA1PAX8POLB
SCHEMBL2313651 0.79 DAO (0.43) POLB
SCHEMBL710773 0.77 DAO (0.44) POLBRECQLNPSR1TDP1
SCHEMBL8847907 0.74 DAO (0.40) NSD2POLBRECQLNPSR1TDP1
SCHEMBL505505 0.74 DAO (0.40) POLB
SCHEMBL7627965 0.74 ROS1 (0.41)
SCHEMBL2479846 0.74 GAA (0.46)
SCHEMBL29395435 0.74 GSK3B (0.39) TDP2TDP1
SCHEMBL15741723 0.74 GSK3B (0.39) TDP2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4225811-A1 POLYMER PARTICLES Queensland University Of Technology (AU) 2023-08-16 EP claimed
CN-101235200-B Polyimide resin composition modified by thermosetting resin CHANGCHUN ARTIFICIAL RESIN FACTORY CO LTD 2011-03-30 CN claimed
CN-101235200-A Polyimide resin composition modified by thermosetting resin CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2008-08-06 CN claimed
EP-2417168-A1 PHOSPHORIC ACID RESISTANT POLYMALEIMIDE PREPOLYMER COMPOSITIONS Huntsman Advanced Materials Americas LLC (US) 2012-02-15 EP disclosed
CN-101235200-B Polyimide resin composition modified by thermosetting resin CHANGCHUN ARTIFICIAL RESIN FACTORY CO LTD 2011-03-30 CN disclosed
EP-2271215-A1 STORAGE-STABLE POLYMALEIMIDE PREPOLYMER COMPOSITIONS Huntsman Advanced Materials Americas LLC (US) 2011-01-12 EP disclosed
WO-2010107750-A1 PHOSPHORIC ACID RESISTANT POLYMALEIMIDE PREPOLYMER COMPOSITIONS HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2010-09-23 WO disclosed
WO-2009123876-A1 STORAGE-STABLE POLYMALEIMIDE PREPOLYMER COMPOSITIONS HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (US) 2009-10-08 WO disclosed
CN-101235200-A Polyimide resin composition modified by thermosetting resin CHANGCHUN ARTIFICIAL RESIN FAC (CN) 2008-08-06 CN disclosed
EP-0424135-A1 Imide prepolymers and cured products thereof MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-04-24 EP disclosed
EP-0394949-A2 Process for producing allylsubstituted phenol compound and the product MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-10-31 EP disclosed
EP-0320238-A1 Imide type prepolymer compositions and processes for preparing same MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1989-06-14 EP disclosed