SCHEMBL5852839

SCHEMBL5852839

C=CC(=O)OCC(CCC)OP(=O)(O)O

nearest known ligand 0.49

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.49
HPGD P15428 1/20 0.42
SMPD1 P17405 3/20 0.37
ALDH1A1 P00352 4/20 0.35
TP53 P04637 3/20 0.35
HIF1A Q16665 3/20 0.35
CYP3A4 P08684 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
MAPK1 P28482 1/20 0.35
ENPP2 Q13822 5/20 0.35
HSD17B10 Q99714 1/20 0.34
LPAR3 Q9UBY5 3/20 0.34
LPAR1 Q92633 2/20 0.34
THRB P10828 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26110733 0.91 TSHR (0.57) TSHRHPGDSMPD1ALDH1A1CYP3A4
SCHEMBL11661449 0.87 TSHR (0.50) TSHRHPGDSMPD1ALDH1A1TP53
SCHEMBL17923964 0.87 TSHR (0.52) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL29424087 0.82 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL18255850 0.80 TSHR (0.54) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL12451814 0.80 TSHR (0.54) TSHRHPGDALDH1A1TP53HIF1A
Acrylic Acid Ethyl Ester SCHEMBL28252529 0.79 TSHR (0.50) TSHRHPGDSMPD1ALDH1A1TP53
SCHEMBL21819975 0.79 TSHR (0.53) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL26108009 0.78 TSHR (0.47) TSHRSMPD1ALDH1A1SMN1; SMN2ENPP2
SCHEMBL947234 0.77 TSHR (0.63) TSHRHPGDSMPD1ALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023190288-A1 MOLDED BODY 積水化学工業株式会社 2023-10-05 WO disclosed
WO-2023190294-A1 THERMALLY EXPANDABLE MICROCAPSULES 積水化学工業株式会社 2023-10-05 WO disclosed
CN-108350127-B Rapidly developing tack elastomeric adhesives 洛德公司 2021-07-06 CN disclosed
CN-112912454-A Reworkable adhesive composition 汉高股份有限及两合公司 2021-06-04 CN disclosed
CN-112437797-A Flame retardant adhesive composition 汉高股份有限及两合公司 2021-03-02 CN disclosed
CN-106795392-B Low temperature elastomer bonding method 洛德公司 2020-09-08 CN disclosed
US-7109253-B1 Dielectric, radiation-curable coating compositions DSM N.V. (NL) 2006-09-19 US disclosed
US-6506814-B2 Good insulating properties in extreme conditions DSM N.V. (NL) 2003-01-14 US disclosed
US-6355599-B1 SUPERCONDUCTING ARTICLE COATED WITH CURED COMPOSITION COMPRISING (METH)ACRYLATE TERMINATED URETHANE OLIGOMER, (METH)ACRYLATE FUNCTIONALIZED ACID ADHESION PROMOTER, AND (METH)ACRYLATE DILUENT DSM DESOTECH, INC. 2002-03-12 US disclosed
US-20020004537-A1 DIELECTRIC, RADIATION-CURABLE COATING COMPOSITIONS DSM IP ASSETS B.V. (NL) 2002-01-10 US disclosed
EP-1086471-A1 DIELECTRIC RADIATION-CURABLE COATING COMPOSITIONS DSM N.V. (NL) 2001-03-28 EP disclosed
US-6021338-A ACRYLATED POLYURETHANE OLIGOMER PROTECTIVE COATINGS DSM DESOTECH INC. (US) 2000-02-01 US disclosed
WO-1999057733-A1 DIELECTRIC RADIATION-CURABLE COATING COMPOSITIONS DSM N.V. (NL) 1999-11-11 WO disclosed
EP-0935804-A1 DIELECTRIC, RADIATION CURABLE COATING COMPOSITIONS AND METAL CONDUCTORS COATED WITH SUCH COATING DSM N.V. (NL) 1999-08-18 EP disclosed
WO-1998019313-A1 DIELECTRIC, RADIATION CURABLE COATING COMPOSITIONS AND METAL CONDUCTORS COATED WITH SUCH COATING DSM N.V. (NL) 1998-05-07 WO disclosed
WO-1995025760-A1 COATED SUPERCONDUCTING WIRE DSM N.V. (NL) 1995-09-28 WO disclosed