Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL5857734

C=COC=C.C=COCCCN.OCCOCCO

nearest known ligand 0.39

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.37
MAPK1 P28482 1/20 0.37
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
THRB P10828 1/20 0.31
HTT P42858 1/20 0.31
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5143193 0.91 MEN1 (0.42) TSHRMAPK1MEN1KMT2ATHRB
Vinyl Ether SCHEMBL27599924 0.86 ODC1 (0.38)
Vinyl Ether SCHEMBL29099774 0.82
Vinyl Ether SCHEMBL27967842 0.82 MEN1 (0.50) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL11118015 0.80 TSHR (0.48) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL4155520 0.80 TSHR (0.48) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL98056 0.79
Di(Hydroxyethyl)Ether SCHEMBL37263 0.79 TSHR (0.59) TSHRMAPK1MEN1KMT2ATHRB
Di(Hydroxyethyl)Ether SCHEMBL27852480 0.78 TSHR (0.46) TSHRMAPK1MEN1KMT2ATHRB
Tetraethylene Glycol SCHEMBL20582127 0.77 MEN1 (0.61) TSHRMAPK1MEN1KMT2ATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111032712-B Alkyl (meth) acrylate polymer and use thereof 综研化学株式会社 2022-08-30 CN disclosed
CN-114080423-A Curable composition and cured product 综研化学株式会社 2022-02-22 CN disclosed
WO-2021006088-A1 CURABLE COMPOSITION AND CURED PRODUCT 綜研化学株式会社 2021-01-14 WO disclosed
EP-1457527-B1 CURABLE COMPOSITION, SEALING MATERIAL, AND ADHESIVE SEKISUI CHEMICAL CO LTD (JP) 2013-03-27 EP disclosed
US-7135518-B2 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2006-11-14 US disclosed
US-20050261412-A1 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2005-11-24 US disclosed
EP-1457527-A1 CURABLE COMPOSITIONS, SEALING MATERIAL, AND ADHESIVE SEKISUI CHEMICAL CO., LTD. (JP) 2004-09-15 EP disclosed