SCHEMBL5865481

SCHEMBL5865481

[Bi].[Ga].[In].[Sn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30834473 0.89
SCHEMBL3720681 0.87
SCHEMBL29446543 0.87
SCHEMBL735757 0.87
SCHEMBL30703062 0.87
SCHEMBL29349641 0.87
SCHEMBL29601232 0.87
SCHEMBL29609406 0.87
SCHEMBL31028391 0.87
SCHEMBL890968 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 118 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119753533-A Aluminum alloy composite material for vehicle and preparation method and application thereof 株洲宜安精密制造有限公司 2025-04-04 CN claimed
CN-119615047-A Gallium oxide fiber and preparation method thereof 甬江实验室 2025-03-14 CN claimed
CN-115674276-B Triboelectric variable-rigidity soft paw state monitoring sensor and testing method thereof 哈尔滨工业大学 2025-01-03 CN claimed
CN-119082734-A Insulating thermal interface material, preparation method thereof and electronic equipment 深圳市鸿富诚新材料股份有限公司 2024-12-06 CN claimed
CN-118895109-A Thermal interface material and preparation method thereof 深圳先进电子材料国际创新研究院 2024-11-05 CN claimed
CN-118694202-A Liquid metal/textile friction nano generator and preparation method thereof 云南师范大学 2024-09-24 CN claimed
CN-117660959-A Stretchable flexible liquid metal pattern with antibacterial capability prepared based on laser technology and preparation method and application thereof 四川大学 2024-03-08 CN claimed
CN-116479365-A Method for rapidly preparing nickel screen-low-melting-point gallium-based alloy composite thermal interface material 大连海事大学 2023-07-25 CN claimed
CN-114506814-B Aluminum activation hydrogen production method, hydrogen production device and power generation equipment 清华大学 2023-03-24 CN claimed
CN-107501953-B Heat-conducting silicone grease containing liquid metal heat-conducting filler 深圳沃尔提莫电子材料有限公司 2023-03-10 CN claimed
CN-108549932-B Brain-like nerve simulation device based on liquid metal 清华大学 2021-09-14 CN claimed
CN-112964059-A Liquid metal temperature-control vacuum induction melting device and temperature control method 昆明理工大学 2021-06-15 CN claimed
CN-112151220-A Preparation method of filiform liquid metal 中国科学院宁波材料技术与工程研究所 2020-12-29 CN claimed
CN-111916744-A Liquid metal composite cathode of zinc ion battery and preparation method and application thereof 中南大学 2020-11-10 CN claimed
CN-209197539-U A kind of liquid metal heat pipe 云南靖创液态金属热控技术研发有限公司 2019-08-02 CN claimed
CN-109687252-A A kind of connection method of the copper using low melting point liquid metal-copper electrical connection 昆明品启科技有限公司 2019-04-26 CN claimed
CN-106701031-A Composite thermal interface material composed of metal mesh and low-melting-point alloy 中电普瑞电力工程有限公司 2017-05-24 CN claimed
CN-106158223-A A kind of magnetic liquid metal and preparation method thereof 成都博盈复希科技有限公司 2016-11-23 CN claimed
US-7141273-B2 Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-11-28 US claimed
US-20050084691-A1 Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-21 US claimed