SCHEMBL5982764

SCHEMBL5982764

CC1=Cc2c(CO[Si](C)(C)C)ccc(C)c2C1[Zr](C1C(C)=Cc2c(CO[Si](C)(C)C)ccc(C)c21)=[Si](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL630281 0.77
SCHEMBL27448768 0.77
Hydrochloric Acid SCHEMBL27513502 0.77
SCHEMBL8411480 0.76
Hydrochloric Acid SCHEMBL5608248 0.76
SCHEMBL1240109 0.75
SCHEMBL5975005 0.70
SCHEMBL6671633 0.70
Chloromethane SCHEMBL5608846 0.68
SCHEMBL8164675 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1632532-A1 SOLVENT DISPERSION OF COMPOSITE RESIN AND USES THEREOF Mitsui Chemicals, Inc. (JP) 2006-03-08 EP disclosed
US-6723794-B2 TO PROVIDE MOLDED PRODUCTS HAVING EXCELLENT TENSILE STRENGTH, ELONGATION AT BREAK AND ELASTOMERIC PROPERTIES MITSUI CHEMICALS, INC. (JP) 2004-04-20 US disclosed
US-20030096912-A1 To provide molded products having excellent tensile strength, elongation at break and elastomeric properties MITSUI CHEMICALS, INC. (JP) 2003-05-22 US disclosed