SCHEMBL598980

SCHEMBL598980

CC1=[N+](C)CC=CN1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL599472 0.62
SCHEMBL12269576 0.59
SCHEMBL598664 0.54
SCHEMBL13057800 0.50
SCHEMBL21290178 0.44 KDM4E (0.32)
SCHEMBL7561903 0.41
SCHEMBL790604 0.40
SCHEMBL766955 0.40
SCHEMBL9683439 0.40
SCHEMBL15484301 0.39

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 175 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12466956-B2 Electroconductive resin composition and molded article of same DENKA COMPANY LIMITED (JP) 2025-11-11 US disclosed
WO-2025079674-A1 THERMOPLASTIC RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079719-A1 COPOLYESTER FILM AND HEAT-SHRINKABLE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079727-A1 LAMINATE HAVING POLYESTER FILM AND FUNCTIONAL LAYER 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079679-A1 POLYESTER FILM, METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079681-A1 WHITE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079717-A1 POLYESTER FILM HAVING RESIN THIN FILM LAYER 東洋紡株式会社 2025-04-17 WO disclosed
US-12024579-B2 Curable liquid composition, particulate filler, and compound TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-02 US disclosed
CN-111849369-B Surface protective film and optical member 日东电工株式会社 2024-04-26 CN disclosed
CN-113382860-B Adhesive sheet and use thereof 日东电工株式会社 2024-03-22 CN disclosed
EP-1693430-A2 Pressure-sensitive adhesive compositions, pressure-sensitive adhesive sheets, and double-sided pressure-sensitive adhesive tapes Nitto Denko Corporation (JP) 2006-08-23 EP disclosed
US-20060024494-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film NITTO DENKO CORPORATION (JP) 2006-02-02 US disclosed
EP-1621596-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film Nitto Denko Corporation (JP) 2006-02-01 EP disclosed
US-20060007629-A1 Electrolyte for electrolytic capacitor, electrolytic capacitor and process for producing tetrafluoroaluminate salt of organic onium MITSUBISHI CHEMICAL CORPORATION (JP) 2006-01-12 US disclosed
EP-1602698-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film Nitto Denko Corporation (JP) 2005-12-07 EP disclosed
US-20050266238-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film NITTO DENKO CORPORATION (JP) 2005-12-01 US disclosed
EP-1582573-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film Nitto Denko Corporation (JP) 2005-10-05 EP disclosed
CN-1667071-A Adhesive composition, adhesive sheets and surface protective film NITTO DENKO CORP (JP) 2005-09-14 CN disclosed
US-20050197450-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film NITTO DENKO CORPORATION (JP) 2005-09-08 US disclosed
EP-1564768-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR, ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING TETRAFLUOROALUMINATE SALT OF ORGANIC ONIUM Mitsubishi Chemical Corporation (JP) 2005-08-17 EP disclosed